Industry News: orbitals (Page 1 of 3)

SMTA Capital Chapter June Meeting Features the Importance of Nano-coatings and Under Wipe Solvents

Industry News | 2014-05-27 11:24:56.0

The SMTA Capital Chapter is pleased to announce its third meeting of 2014 is scheduled for Tuesday, June 17, 2014, at Orbital Sciences Corporation in Dulles, VA.

Surface Mount Technology Association (SMTA)

Importance of Nano-coatings and Under Wipe Solvents Featured at SMTA Capital Chapter June 17th Meeting

Industry News | 2014-06-08 14:54:39.0

The SMTA Capital Chapter is pleased to announce its third meeting of 2014 is scheduled for Tuesday, June 17, 2014, at Orbital Sciences Corporation, Building 1 Auditorium, in Dulles, VA.

Surface Mount Technology Association (SMTA)

Europa Clipper Harness Engineer Jacklyn Perry to Deliver Keynote at Electrical Wire Processing Technology Expo (EWPTE)

Industry News | 2022-03-17 07:33:24.0

How will a spacecraft harness connect every electrical device on the Europa Clipper, a Jupiter-orbiting spacecraft that will study Jupiter's icy moon Europa? Jacklyn Perry, harness engineer at Johns Hopkins University Applied Physics Laboratory (JHU APL), will provide the answer when she delivers the keynote address, "Harnessing Europa," at the Electrical Wire Processing Technology Expo (EWPTE), on May 11.

Association Connecting Electronics Industries (IPC)

James Webb Telescope Engineer Dr. Kenneth Harris II to Deliver Keynote at EWPTE 2023

Industry News | 2023-03-06 17:25:27.0

Kenneth Harris II, Eng.D. will deliver the opening keynote at Electrical Wire Processing Technology Expo (EWPTE). Acknowledged by Forbes Magazine as one of the world's youngest and most influential individuals in the field of science, he will present "Building the Future," on Wednesday, May 17, 2023, at the Wisconsin Center in Milwaukee, Wis.

Association Connecting Electronics Industries (IPC)

DART Mission Leader Ed Reynolds to Keynote IPC High Reliability Forum

Industry News | 2023-07-19 09:27:00.0

Ed Reynolds, space exploration sector program manager at Johns Hopkins Applied Physics Laboratory (APL), will present his keynote address, "The DART Mission: Earth Strikes Back," at IPC's High Reliability Forum on October 17 in Linthicum (Baltimore), Md.

Association Connecting Electronics Industries (IPC)

Peter Barry, Mission Assurance Manager at Jet Propulsion Laboratory, to Present Keynote at SMTAI 2009

Industry News | 2009-05-29 13:39:19.0

Minneapolis, MN - The SMTA Annual Meeting and Awards Ceremony at SMTA International, October 7, 2009, will feature Mission Assurance Manager at Jet Propulsion Laboratory (JPL), Peter Barry, as the keynote speaker.

Surface Mount Technology Association (SMTA)

B. Gentry Lee to Keynote 2020 WHMA 27th Annual Wire Harness Conference

Industry News | 2019-09-10 13:35:15.0

B. Gentry Lee will present his keynote address, “A Passion for Space Exploration,” at the WHMA 27th Annual Wire Harness Conference, February 19, 2020, in Las Vegas, Nevada. During his keynote presentation, Lee will talk about the highlights of his exploration career and touch on the role of wires and harnesses on the most memorable spacecraft.

Association Connecting Electronics Industries (IPC)

What are the operating steps of the Full-auto SMT Stencil Printer in SMT Production Line?

Industry News | 2022-11-22 06:14:08.0

Full-auto SMT Stencil Printer is indispensable equipment in SMT production Line. It is generally composed of board mounting, solder paste, imprinting, and circuit board transfer. Widely used are Full-auto SMT Stencil Printer and semi-auto SMT Stencil Printer These two types, next, let's share with you the operating instructions of Full-auto SMT Stencil Printer.

Dongguan Intercontinental Technology Co., Ltd.

IPC Volunteers Honored for their Contributions to the Electronics Industry at IPC APEX EXPO 2018 More than 300 awards presented

Industry News | 2018-03-14 18:46:31.0

IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO 2018 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

Association Connecting Electronics Industries (IPC)

Endicott Interconnect Technologies' Wire Bond Product Launched into Space.

Industry News | 2007-11-08 21:34:39.0

Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.

i3 Electronics

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