Industry News | 2018-02-26 10:51:50.0
IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2018 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.
Industry News | 2017-03-08 19:49:16.0
ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has won an order for its Mosaic Plasma Dicing System from JCAP Corporation (Jiangyin Changdian Advanced Packaging Co., Ltd), a JCET company and leading Chinese advanced packaging services provider to global semiconductor companies. Orbotech's SPTS also announced that a recent analysis of MEMS microphones in the iPhone 7 Plus conducted by System Plus Consulting[1] confirmed that an ASIC device in the iPhone 7 Plus had been plasma diced.
Industry News | 2017-09-12 23:21:32.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation, will exhibit in Booth #607 at SMTA International. The Nordson Test & Inspection team will showcase a suite of award-winning systems including the Quadra™ 7 X-ray Inspection system and FX-940 ULTRA 3D AOI system.
Industry News | 2018-09-19 21:20:03.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #207 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The Nordson Test & Inspection team will showcase a suite of award-winning systems including the Quadra™ 7 X-ray Inspection System, Nordson YESTECH FX-940 Ultra AOI and FX-940-UV AOI.
Industry News | 2016-08-31 19:01:58.0
Nordson YESTECH will exhibit in Booth #606 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. The YESTECH team will demonstrate the FX-940 ULTRA 3D AOI with cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices.
Industry News | 2016-02-17 17:30:41.0
Nordson YESTECH announced today that they will launch their latest innovation in 3D inspection in Booth #1745 at the IPC APEX EXPO, scheduled to take place in Las Vegas, USA from 15th – 17th March 2016.
Industry News | 2017-08-15 21:42:58.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #607 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The Nordson Test & Inspection team will showcase a suite of award-winning systems including the Quadra™ 7 X-ray Inspection system and FX-940 ULTRA 3D AOI system.
Industry News | 2016-10-04 19:02:49.0
Yamaha Motor Corporation, USA won a coveted Global Technology Award for the company’s new ultra‐high‐speed Z:TA-R / YSM40R modular surface mounter, which boasts the world’s fastest placement rates and area productivity at 200,000 CPH. The award was presented to the company on Tuesday, September 27th, 2016 at the SMTAI 2016 Conference and Exhibition at the Donald Stephens Convention Center in Rosemont, Illinois and was accepted by George Babka, Sales General Manager.
Industry News | 2013-10-08 16:27:28.0
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will highlight its newest machines in Hall A3, Stand 341 at the 20th international productronica international trade fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2016-05-31 21:45:20.0
Yamaha IM America announces the launch of the new ultra‐high‐speed Z:TA-R / YSM40R modular surface mounter, which boasts the fastest placement rates and area productivity, at an unmatched 200,000 CPH: the fastest in the world.
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