Industry News: osp solderability (Page 1 of 5)

IPC Honors Best Technical Papers At IPC Apex Expo 2011

Industry News | 2011-04-20 21:19:17.0

IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.

Association Connecting Electronics Industries (IPC)

SMTA Launches On-line SMT Processes Re-Certification

Industry News | 2013-08-07 09:58:46.0

The SMTA launched an online re-certification program for engineers whose 10-year SMT Processes Certification is expiring.

Surface Mount Technology Association (SMTA)

New High Thermal & Impact Reliability Solder and Water Soluble Flux from SHENMAO

Industry News | 2018-06-03 19:11:33.0

SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.

Shenmao Technology Inc.

Kyzen's Rich Brooks Holds Successful Presentation at SMTA Silicon Valley Chapter Meeting

Industry News | 2010-04-28 20:24:38.0

NASHVILLE — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Rich Brooks held a successful presentation at the SMTA Silicon Valley Chapter meeting, which took place on Thursday, April 22, 2010 from 3-5:30 p.m. at EET, Inc. in Reno, NV.

KYZEN Corporation

Nihon Superior's Keith Sweatman to Present at APEX 2010

Industry News | 2010-03-30 14:09:38.0

OSAKA, JAPAN - Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman will present a paper titled "Effect of Soldering Method, Temperature, and Humidity on Whisker Growth in the Presence of Flux Residues" at the upcoming IPC/APEX conference and exhibition.

Nihon Superior Co., Ltd.

Nihon Superior Highlights IMC Differences between Low-Ag and No-Ag Lead-Free Solders

Industry News | 2011-12-30 23:26:12.0

Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.

Nihon Superior Co., Ltd.

Super PCB Offers High-Quality Surface Finishes

Industry News | 2018-11-27 14:03:14.0

Super PCB is pleased to announce that it offers a variety of quality PCB surface finishes. PCB surface finish is the coating between the PCB and components that provides a solderable surface for components and protects the exposed copper circuitry.

Super PCB

KYZEN to Showcase Advanced Packaging Solutions at PCIM Europe 2024

Industry News | 2024-05-20 10:37:16.0

KYZEN is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. Visitors can find KYZEN at Hall 5, Stand 100, where the focus will be on advanced packaging solutions, specifically highlighting the MICRONOX® MX2123 Multi-Process Power Module Cleaner.

KYZEN Corporation

SMART Group Launches Next FREE Guide in the Series: PCB Surface Finish Defect Guide

Industry News | 2017-04-04 15:22:45.0

SMART Group announces that the “Printed Circuit Solderable Finish Defect Guide” has been printed and is available free of charge.

The SMART Group

Nihon Superior’s Keith Sweatman to Present at TMS 2010

Industry News | 2010-02-08 12:11:13.0

OSAKA, JAPAN — February 2010 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman will present a paper titled “The Relationship between Whisker Growth and Corrosion in Sn-3.0Ag-0.5Cu” at the upcoming TMS 2010 Annual Meeting & Exhibition, scheduled to take place February 14-18, 2010 at the Washington State Convention Center in Seattle.

Nihon Superior Co., Ltd.

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