Industry News: osp type (Page 1 of 1)

ECT Technical Expert to Discuss Breakthrough PCBA Test Probe Technologies at SMTAI 2013

Industry News | 2013-09-17 07:05:11.0

Everett Charles Technologies’ (ECT) today announced that Brian Crisp will present at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

Everett Charles Technologies

New High Thermal & Impact Reliability Solder and Water Soluble Flux from SHENMAO

Industry News | 2018-06-03 19:11:33.0

SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.

Shenmao Technology Inc.

FCT Assembly's NL930PT Pin Probable Paste Wins a 2011 NPI Award

Industry News | 2011-04-20 20:31:30.0

FCT Assembly is pleased to announce that it has been awarded a 2011 NPI Award in the category of Soldering Materials for its NL930PT Pin Probable Solder Paste.

FCT ASSEMBLY, INC.

FCT Assembly Premiers WS159 Tin-Lead Water-Soluble Solder Paste

Industry News | 2009-05-18 17:19:51.0

GREELEY, CO - FCT Assembly debuts WS159 water-soluble solder paste, featuring FCT's latest technology in print and reflow of paste in the water soluble category.

FCT ASSEMBLY, INC.

FCT Assembly Introduces WS177 Lead-Free, Water-Soluble Solder Paste

Industry News | 2009-05-20 19:17:30.0

GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.

FCT ASSEMBLY, INC.

Christopher Associates/Koki Solder to Present Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes at SMTAI 2010

Industry News | 2010-09-29 23:32:58.0

Christopher Associates/Koki Solder announce that Jasbir Bath will present a paper titled “An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Christopher Associates Inc.

FCT Assembly Debuts NL930 Lead-free No-Clean Solder Paste

Industry News | 2009-11-02 21:59:00.0

GREELEY, CO —FCT Assembly premiers NL930, a lead-free, no-clean solder paste that features the company’s latest technology in print and reflow of paste in the no-clean category.

FCT ASSEMBLY, INC.

Immersion gold VS Plating gold

Industry News | 2019-05-16 01:27:23.0

There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.

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