Industry News: overlapped drill holes (Page 3 of 8)

Plated Half Holes PCB

Industry News | 2018-10-18 10:46:44.0

Plated Half Holes PCB

Flason Electronic Co.,limited

How to Generate Gerber Files Using Altium Designer

Industry News | 2018-10-18 11:28:01.0

How to Generate Gerber Files Using Altium Designer

Flason Electronic Co.,limited

Isola Introduces Very Low-Loss Materials for Advanced Automotive Safety and Driver Assistance Systems

Industry News | 2013-08-09 18:51:29.0

Isola Group announced Astra™, the company's breakthrough very low-loss dielectric constant (Dk) product for millimeter wave frequencies and beyond. Astra revolutionizes RF and microwave designs, as it delivers a thermoset solution, which is very easy to process and has stable electrical properties over a wide range of temperatures and frequencies.

Isola Group

A coWeller Erem™ Relaunches Line of High-Precision Cutters, Pliers & Tweezers

Industry News | 2020-09-06 04:46:35.0

Weller Erem™, the world's No.1 brand in precision tool solutions, is pleased to announce that it has rebranded and relaunched 300 products worldwide.

Weller/Apex Tool Group

Blind and Buried Via Boards

Industry News | 2018-10-18 11:14:24.0

Blind and Buried Via Boards

Flason Electronic Co.,limited

Importing 3D STEP files into FAB 3000

Industry News | 2016-07-14 21:20:13.0

FAB 3000 now has the ability to import 3D STEP files. A perfect solution for Mechanical Engineers who need to communicate with 2D ECAD engineers or convert their 3D designs to Gerber, ODB++, etc. Extract Board shapes, critical components, circuits, and generate files for PCB manufacturing purposes.

Numerical Innovations

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Industry News | 2008-01-16 13:33:47.0

Endicott Interconnect Technologies, Inc. (EI) announced today that it has fabricated an award winning, printed circuit board for IBM Zurich Research Laboratory (ZRL).

i3 Electronics

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Industry News | 2008-02-19 10:13:23.0

Endicott Interconnect Technologies, Inc. (EI) announced today that it has fabricated an award winning, printed circuit board for IBM Zurich Research Laboratory (ZRL).

i3 Electronics

LPKF to Exhibit Technologies for RF/Microwave at IMS Baltimore 2011

Industry News | 2011-06-07 14:37:33.0

LPKF will exhibit its ProtoMat S63 and ProtoLaser S in Booth #2202 at the upcoming IEEE Microwave Theory & Techniques Society (MTT-S) International Microwave Symposium for 2011 (IMS2011), scheduled to take place June 7-9 2011 at the Baltimore Convention Center in Baltimore, Maryland.

LPKF Laser & Electronics

What's usage of Via tenting for PCB design?

Industry News | 2019-11-05 22:07:01.0

Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.

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