Industry News | 2018-10-18 10:40:04.0
Via Tent-Holes with Solder Mask
Industry News | 2011-10-12 21:39:45.0
Multitest announces that the Santa Clara board fab has refined its pulse plating process to integrate it into Multitest’s fabrication process to further enhance the high aspect ratio capability.
Industry News | 2017-01-10 09:21:43.0
Cogiscan announced that it was chosen by Universal Instruments to support traceability and connectivity requirements for one of its major customers. Universal was recently selected by a leading EMS provider to source and supply complete production lines for a new facility. The customer requirement included Universal’s core product offerings for automated pick-and-place in SMT and automated through-hole insertion, as part of a comprehensive factory-wide solution.
Industry News | 2018-10-18 11:15:12.0
PCB Design and Layout Guidelines
Industry News | 2018-10-18 11:23:54.0
6 Things to Check Before Submitting Your PCB Design for Manufacturing
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2012-04-18 18:34:11.0
Universal Instruments will launch the premier pick-and-place solution for the growing solid-state lighting market with the introduction of the Advantis® AC-60 LED Platform at the NEPCON tradeshow in Shanghai, China, April 25–27. The Advantis AC-60 LED features focused yet flexible performance, maximizing productivity for both LED and surface mount applications by leveraging Universal’s proven Lightning® placement head.
Industry News | 2018-11-14 15:34:52.0
Viscom AG will premier a new 3D bond inspection system at electronica 2018 in Munich. The Hanover-based inspection technology expert is thus expanding its diverse 3D product range from 3D SPI, 3D AOI and 3D X-ray technology to include bond inspection, further reinforcing its technology leadership in 3D inline inspection for the electronics manufacturing industry.
Industry News | 2010-06-04 01:46:26.0
Taiwan - Where PCB Prototype and PCB Fabrication Happens, Circuit Board Design, Circuit Board Prototype, Printed Circuit Board Fabrication, PCB Assembly.
Industry News | 2014-04-08 11:43:03.0
Isola Group has launched a technology-licensing program to mitigate conductive anodic filamentation (CAF) problems in the fabrication of PCBs. This proprietary manufacturing technology, which is offered by ISOLA USA Corp. "Isola USA", reduces the number of voids in resin-impregnated dielectrics, which is a major source of CAF failures.
