Industry News: oxidants (Page 15 of 29)

Indium Corporation Announces RMA-155 Pb-Free Solder Paste.

Industry News | 2014-07-09 10:22:05.0

Indium Corporation recently released RMA-155 Pb-Free Solder Paste. RMA-155 is the best solder paste for customers who are required to use RMA materials, but who need the performance benefits of modern Pb-free solder paste technology.

Indium Corporation

Gen3 Systems Announces the Next Generation of Solder saver

Industry News | 2014-07-23 16:57:10.0

Gen3 Systems Limited announces the new and improved Solder saver.

Gen3 Systems

Indium Corporation Features Indium10.1 Pb-Free Solder Paste at SMTAi.

Industry News | 2014-08-05 17:29:07.0

Indium Corporation will feature its new solder paste, Indium10.1, at the SMTAi 2014. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

Indium Corporation

KYZEN to Show Leading Chemistries at MECSPE

Industry News | 2015-03-24 10:54:03.0

KYZEN will exhibit in Hall 2, Stand L03 at MECSPE, scheduled to take place March 26-28, 2015 at the Parma Fairground in Italy. KYZEN’s team will showcase METALNOX® M6380 and KYZEN® CP90S.

KYZEN Corporation

Solder Joint Encapsulant

Industry News | 2015-05-13 14:00:03.0

The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.

YINCAE Advanced Materials, LLC.

Indium Corporation Low-Voiding Solder Paste Helps Users Avoid the Void at Productronica 2015

Industry News | 2015-11-12 12:08:30.0

Indium Corporation presented its suite of void-reducing solder pastes, including halogen-free, no-clean Indium8.9HF, at Productronica 2015, Nov. 10-13, in Munich, Germany.

Indium Corporation

Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016

Industry News | 2016-02-06 01:03:23.0

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo.

Indium Corporation

Indium Corporation’s Indium8.9HF Solder Paste Technology Solution to Avoid the Void™

Industry News | 2016-02-11 13:36:43.0

Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.

Indium Corporation

Indium Corporation’s Low-Voiding Solder Pastes Featured at IPC APEX 2016

Industry News | 2016-03-17 14:15:35.0

Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo.

Indium Corporation

Indium Corporation's Indium8.9HF Solder Paste Series Technology Solution to Avoid the Void™

Industry News | 2016-04-06 12:15:05.0

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany.

Indium Corporation


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