Industry News: pac (Page 1 of 8)

Pac Tech USA Offering Contract Wafer Bumping, Stencil Services

Industry News | 2003-01-27 10:27:31.0

At a New Facility Within the Company's U.S. Headquarters

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Libra Industries & Others Selling Excess Manufacturing Assets

Industry News | 2015-08-03 11:42:47.0

EMS provider Libra Industries in Ohio is continually upgrading their manufacturing capabilities. As part of this process; they will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 8:00am EST on August 17, 2015 and the closing will begin at 1:00pm EST on August 19, 2015.

Baja Bid

Pan Pac Symposium Registration Now Open

Industry News | 2010-11-04 22:57:30.0

The SMTA is pleased to announce plans are now finalized for the 2011 Pan Pac Symposium and Tabletop Exhibition.

Surface Mount Technology Association (SMTA)

Pan Pacific Symposium - Early Bird Deadline is December 15th. Save Money, Register Now!

Industry News | 2010-12-01 13:54:27.0

The SMTA is pleased to announce plans are now finalized for the 2011 Pan Pac Symposium and Tabletop Exhibition.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Concludes on a Positive Note

Industry News | 2009-11-06 17:10:00.0

Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the the 6th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2012-08-02 11:47:58.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Concludes Successfully

Industry News | 2011-11-08 15:31:27.0

The SMTA and Chip Scale Review magazine are pleased to announce the 8th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success.

Surface Mount Technology Association (SMTA)

SMTAI to Emphasize Pb-Free Manufacturing

Industry News | 2002-05-10 08:10:07.0

During Its Annual Conference this Fall

Surface Mount Technology Association (SMTA)

SMTA Announces Pan Pacific Symposium Call for Participation

Industry News | 2003-05-27 08:13:23.0

The Ninth Annual Pan Pacific Microelectronics Symposium

Surface Mount Technology Association (SMTA)

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