Industry News | 2011-08-24 22:37:23.0
The SMTA announced that it will hold sessions and a tutorial on Package-on-Package (PoP) surface mount stacking at their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Industry News | 2013-04-02 17:20:44.0
The SMTA is pleased to announce the program for the 2013 International Conference on Soldering and Reliability being held May 14-17 in Toronto, Ontario, Canada.
Industry News | 2012-07-12 10:34:27.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Industry News | 2012-07-12 10:34:54.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Industry News | 2003-04-29 07:30:06.0
Announce their plans to co-sponsor a free online conference on the current state of bare die packaging
Industry News | 2022-10-04 11:11:32.0
Two of the electronics industry's most far-sighted and innovative leaders have been named to the U.S. Department of Commerce's new Industrial Advisory Committee (IAC), which will provide guidance to the Secretary of Commerce on a range of issues related to CHIPS for America Act programs.
Industry News | 2011-02-05 14:02:52.0
IPC announces its Winter Webinar Series for February and March 2011. Focused on technical challenges facing the electronics manufacturing industry, including lead-free reliability issues, high voltage PCB design, package on package (PoP) assemblies, PoP component manufacturing, thermal cycle testing and barrel failures, the one-hour webinars offer companies a great opportunity to bring IPC technical information to a large number of employees at one time.
Industry News | 2008-02-22 16:25:50.0
The SMTA is pleased to announce its spring packaging symposium. The 3D/SiP Advanced Packaging Symposium will be held April 28-30 at the Washington Duke Inn & Golf Club in Research Triangle Park, NC.
Industry News | 2009-11-06 17:10:00.0
Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the the 6th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California.
Industry News | 2022-07-31 19:57:28.0
IPC issued the following statement from President and CEO John Mitchell on today's passage of the "CHIPS+" legislation in the U.S. House of Representatives, which follows Senate approval and paves the way to U.S. President Joe Biden's signature:
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
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