Industry News | 2003-04-29 07:30:06.0
Announce their plans to co-sponsor a free online conference on the current state of bare die packaging
Industry News | 2014-02-13 23:58:33.0
Nordson ASYMTEK introduces the Quantum™ Q-6800 high-performance, large-format dispensing system for SMT, PCB packaging, and microelectronics assembly applications. Quantum’s dispense area of 423 x 458 mm handles a wide range of substrate sizes and is large enough so the dispense area isn’t compromised even with dual valve configurations, enabling flexibility in the dispensing process.
Industry News | 2016-01-26 16:30:02.0
The SMTA is pleased to announce the Best Papers from SMTA International 2015. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Industry News | 2014-09-06 17:51:35.0
IPC — Association Connecting Electronics Industries® has released the F revisions of two of the industry’s most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies.
Industry News | 2015-11-12 20:28:42.0
Nordson ASYMTEK introduces the Spectrum™ II Premier with the IntelliJet® jetting system for dispensing small dot sizes at high frequencies without compromising the precision, high yield, and long-term reliability needed for advanced packaging applications. The IntelliJet system incorporates ASYMTEK's patent-pending 2-piece ReadiSet™ jet cartridge for fast and simple cleaning and maintenance.
Industry News | 2024-01-02 07:59:07.0
Explore the versatility of Automated IC Programming Systems, decoding a myriad of package types for precise and efficient electronics manufacturing.
Industry News | 2021-12-01 15:56:50.0
The SMTA is seeking donations for the Charles Hutchins Grant and JoAnn Stromberg Student Leader Scholarship for the upcoming year. Both of these awards are made possible exclusively through donations by businesses and individuals.
Industry News | 2013-08-20 23:02:16.0
Nordson ASYMTEK has developed Continuous Path Motion Control software for jetting underfill for flip chips. The software optimizes dispense head motion, saving time and increasing units per hour (UPH). Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the dispense head maintains a continuous speed and direction throughout the process.
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2013-11-26 14:46:08.0
The 2013 International Wafer-Level Packaging Conference (IWLPC), organized by SMTA and Chip Scale Review magazine, celebrated its 10th consecutive annual event on November 5-7, 2013 with a very successful conference and exhibition. Technical presentations covered a large range of applications, challenges, and solutions. This 10th anniversary event with over six hundred total participants had thirty-nine presentations in three parallel tracks over the two days.
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