Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2003-06-04 08:27:58.0
DuPont cites rising raw material, transportation and energy costs as reasons for the increase.
Industry News | 2003-06-16 08:33:59.0
This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.
Industry News | 2018-04-16 20:18:35.0
SMTA Europe announces Session 5 Technical Program on Adhesives and Coatings at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2008-05-01 11:14:36.0
Component packaging technology continues to decrease in size (length, width, thickness), interconnection density per unit area is increasing (thinner PCB�s, smaller lines & spaces), functional performance is increasing (thermal, mechanical, electrical) at the same time as assembly processes are changing to lead-free assembly and other legislated requirements.
Industry News | 2002-03-27 09:42:31.0
Glenn Woodhouse and Janet Semmens were named winners of the Best of Conference Awards
Industry News | 2020-07-01 12:08:16.0
For high precision low stress PCB singulation of panels with sensitive components near the parting edge, and with the smooth edge finish required by military specifications or by packaging considerations, using a Diamond Blade Saw beats routing for speed and for blade life. The saw blade, a 2.95" (75mm) diameter .021" thick diamond coated cutting disk, provides a low-stress, ultra smooth edge finish for separting panelized Printed Circuit Cards. ts which overhang the parting line will remain intact.
Industry News | 2015-04-06 12:45:50.0
Count On Tools today announced they will display an array of products in the Adopt SMT booth, Hall 7-100, at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 in Nuremberg, Germany.
Industry News | 2010-05-30 23:23:13.0
Minneapolis, MN - The Surface Mount Technology Association (SMTA) announces the Call for Papers for the 2011 Pan Pacific Microelectronics Symposium, which will be held January 18-20, 2011 on the Big Island of Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 16, 2010.
