Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2017-10-17 19:32:15.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce plans to exhibit its award-winning MV-6 OMNI 3D AOI System in Hall A2, Booth 329 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. Additionally, the company will show the MS-11e 3D SPI, MV-3 OMNI Desktop 3D AOI and INTELLISYS® software.
Industry News | 2017-04-24 19:04:48.0
This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
Industry News | 2016-09-11 12:12:28.0
SMTA China announces that it presented awards for seven papers at the SMTA China 10th Anniversary Reception, held on Tuesday, August 30, 2016 at Shenzhen Convention & Exhibition Center in conjunction with the NEPCON South China Show.
Industry News | 2017-07-23 20:13:17.0
SMTA announces an expanded program for the final day of the SMTA International Conference, September 17 - 21, 2017 in Rosemont, Illinois. In addition to the Lead-Free Symposium, the technical committee expanded the Thursday program to four concurrent tracks. The three additional tracks will focus on Advanced Packaging Technology, Manufacturing Excellence, and Inspection Technologies.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2012-02-23 14:43:13.0
IPC has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2012. Selected through a ballot process by the event’s Technical Program Committee, the papers will be presented at IPC APEX EXPO, February 28–March 1, at the San Diego Convention Center.
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2018-04-17 21:06:54.0
SMTA is excited to announce the technical program has been finalized and registration is now open for the International Conference for Electronics Enabling Technologies. The event will be held June 5-7, 2018 in Markham, Ontario, Canada.
Industry News | 2016-09-22 17:27:09.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 15, 2017, and will be displayed throughout the event, offering additional visibility.
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