Industry News | 2013-04-03 18:46:12.0
IPC – Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2014 IPC APEX EXPO® at the Mandalay Bay Resort and Convention Center in Las Vegas.
Industry News | 2018-09-18 20:19:23.0
SHENMAO America, Inc. is pleased to announce plans to exhibit in booth 233 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon. During the two-day expo, the company will showcase its PQ10 low-temperature solder paste and PF606-P245 new generation lead-free zero halogen solder paste.
Industry News | 2017-08-30 16:58:11.0
Akrometrix will be a panelist in the upcoming SMTAI Spotlight 5 panel discussion, scheduled to take place Wednesday, Sept. 10, 2017 from 2-3 p.m. The discussion, entitled “Warpage Induced Defects and Component Warpage Limits,” will be streamed on Facebook Live.
Industry News | 2024-09-16 18:36:04.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the rising demand for ultra-thin electronic packages. As package thinness increases, issues like package warpage and its detrimental effects on production yield have become critical challenges. SHENMAO is addressing these concerns with its new Low-Temperature Solder (LTS) materials, which are engineered to lower reflow temperatures, mitigating PCB and substrate deformation while enhancing overall yield rates.
Industry News | 2015-04-07 15:42:29.0
Akrometrix will display the latest surface measurement equipment platform, the CXP, in the Microtronic Booth, #7-101L, at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg Germany.
Industry News | 2021-07-08 05:33:04.0
Laserssel Co., LTD is pleased to introduce its CLSR 6000 high-end Laser Compression Bonder for semiconductor packages. This soldering technique uses high accuracy compression tools and Area Laser bonding introduced with LSRTM(Laser Selective Reflow) in order to minimize warpage on extremely thin packages and substrates. This technology has been adopted for high-end 2.5D packaging with dimensions larger than 60x60mm and NAND modules thinner than 50 µm.
Industry News | 2015-12-02 17:31:50.0
Akrometrix LLC today announced the company’s entry into the Fan Out Wafer Level Processing (FOWLP) market with an innovative, single shot full field of view warpage metrology system for panels up to 600 x 600 mm.
Industry News | 2017-08-14 18:57:16.0
Akrometrix will display its newest warpage metrology system in Booth #124 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The new Tabletop Shadow Moiré (TTSM) system responds to the industry’s demand for an ultra-fast tabletop warpage metrology system.
Industry News | 2017-06-29 18:37:43.0
Akrometrix is pleased to announce that it has launched its newest warpage metrology system – the Tabletop Shadow Moiré (TTSM) system.
Industry News | 2016-04-29 12:00:45.0
Akrometrix today announced that the company has shipped its 300th shadow moiré metrology system to a leading back-end company in South Korea.
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