Industry News | 2015-07-01 14:55:55.0
Akrometrix is pleased to announce that Mayson Brooks has joined the company as President & CEO, effective July 6, 2015. Mr. Brooks brings significant experience in semiconductor inspection and metrology for both front and back-end applications, especially in advanced packaging, which is an excellent fit for the strategic direction of Akrometrix.
Industry News | 2018-07-08 18:45:56.0
SHENMAO America, Inc. today announced plans to exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, July 12, 2018 at the Embassy Suites Cleveland Rockside. Company representatives will showcase the new PQ10 Low Temperature Solder Paste.
Industry News | 2010-08-27 07:25:03.0
Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.
Industry News | 2014-08-05 17:23:21.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) on Monday, September 29 in Rosemont, Ill.
Industry News | 2019-04-15 06:42:26.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at the 2019 IEEE Electronic Components and Technology Conference (ECTC), scheduled to take place May 28-31, 2019 at The Cosmopolitan of Las Vegas. The company will showcase its PQ10 series low temperature solder paste in Booth #500.
Industry News | 2019-08-12 20:00:01.0
SHENMAO America is pleased to announce that it will exhibit at the 31st Annual Electronics Packaging Symposium- Small Systems Integration, scheduled to take place Sept. 5-6, 2019 in Binghamton, NY. Watson Tseng, General Manager, SHENMAO America, will present “New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly.”
Industry News | 2020-11-06 17:27:12.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting the paper, "Power Package Attach by Silver Sintering – Process, Performance & Reliability" at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.
Industry News | 2002-05-06 09:11:12.0
At SEMICON Singapore 2002
Industry News | 2013-01-14 11:20:58.0
ViTrox Technologies,will exhibit in Booth #2707 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California.
Industry News | 2013-04-16 16:05:34.0
ViTrox Technologies, will exhibit in Booth #1H60 at NEPCON China 2013, scheduled to take place April 23-25, 2013 at the Shanghai World EXPO Exhibition & Convention Center.
.jpg)
