Industry News | 2022-04-13 10:22:58.0
MIRTEC will premier its line of 3D AOI and SPI Inspection Systems Hall 4A, Stand 128 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg.
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2015-01-21 21:05:20.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #2333 at the 2015 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 24–26, 2015 at the San Diego Convention Center.
Industry News | 2017-04-24 19:04:48.0
This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
Industry News | 2021-10-11 16:13:11.0
MIRTEC will showcase its cutting-edge INTELLI-PRO AI Based Smart Factory Automation Solution and GENSYS-PIN Automotive Pin Inspection System in booth #461, Hall A2 at the 2021 Productronica exhibition. The world's largest exhibition for the electronic manufacturing industry will take place on Nov. 16-19, 2021, at Messe Munich exhibition hall in Germany.
Industry News | 2023-08-14 12:26:47.0
See the Nordson Electronics Solutions equipment and talk to experts about the latest in fluid dispensing for semiconductor packaging at booth #L0800
Industry News | 2020-09-17 12:23:10.0
Talk to the experts and see demonstrations of the latest equipment for test and inspection, fluid dispensing, and plasma treatment in one booth, #I2716
Industry News | 2017-08-29 15:41:30.0
The SMTA and Chip Scale Review are pleased to announce the Workshops for the 14th Annual International Wafer-Level Packaging Conference (IWLPC) held October 26th. IWLPC will be held October 24-26, 2017 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2021-08-13 12:11:05.0
The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is "Advanced Packaging: The Dawn of a New Era." The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements.
Industry News | 2008-02-22 16:25:50.0
The SMTA is pleased to announce its spring packaging symposium. The 3D/SiP Advanced Packaging Symposium will be held April 28-30 at the Washington Duke Inn & Golf Club in Research Triangle Park, NC.
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