Industry News: packaging density (Page 1 of 44)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Deep Micro-vias Available on Large-format PCBs

Industry News | 2003-02-25 08:18:29.0

Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.

SMTnet

Circuit World Announces License of Channel Routing Technology from Nortel Networks

Industry News | 2003-06-25 12:40:26.0

to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks

SMTnet

Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

SMTnet

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

MIRTEC Wins $15M Contract with Leading Mobile solution Providers

Industry News | 2009-07-12 14:19:25.0

Seoul Korea — July 2009 — MIRTEC, “The Global Leader in Inspection Technology,” announces that the company has been awarded contracts totaling more than $15M with leading mobile solution manufacturers for its MV-7xi inline automated optical inspection (AOI) systems.

MIRTEC Corp

Virtex-II FPGA Prototyping Boards Enable Complex FPGA Design Evaluation & Testing

Industry News | 2003-06-16 09:12:35.0

Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces

SMTnet

MIRTEC RECEIVES 2009 FROST & SULLIVAN AWARD FOR PRODUCT INNOVATION IN THE AOI EQUIPMENT MARKET

Industry News | 2009-03-06 00:15:58.0

OXFORD, CT � March 2009 � MIRTEC, �The Global Leader in Inspection Technology,� announces that it is the recipient of the 2009 Frost & Sullivan Award for Product Innovation in the AOI Equipment Market.

MIRTEC Corp

VEXOS Selects MIRTEC as 3D AOI 'Partner of Choice'

Industry News | 2021-01-17 17:28:43.0

MIRTEC is pleased to announce that VEXOS has selected MIRTEC as their 3D AOI 'Partner of Choice' based on key performance indicators including Inspection Performance, Gage R$&R, Ease of Programming and Customer Support.

MIRTEC Corp

Pulse Offers Highest Power Density SMT Planar Transformer

Industry News | 2003-01-24 09:07:53.0

For Industrial, Telecom and Datacom Use

SMTnet

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