Industry News | 2017-08-14 18:22:34.0
The SMTA Capital Chapter is pleased to announce that Shannan O’Shaughnessy of GVD Corporation, will present “Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Industry News | 2018-03-05 16:33:39.0
MicroCare Corp. introduced a major expansion of the precision cleaning products to visitors at the IPC APEX EXPO, in San Diego, CA Feb. 27-March 1, 2018. Among the innovations were a new heavy-duty degreaser in an aerosol package, a heavy-duty cleaner for mass transit systems, and an innovative pre-saturated cleaning wipe designed specifically to enhance ESD programs in manufacturing facilities. All of these products will be shipping and available from distributors world-wide within the next 45 days.
Industry News | 2017-04-23 11:26:16.0
Microtronic GmbH is pleased to announce that it will introduce its new LBT210-HD (Heavy duty) Solderability Tester in Stand 221J in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany. Microtronic remains the technology leader with the only heavy duty automatic and PC-controlled solderability tester. The revolutionary system is designed to meet today’s current industry challenges, accommodating heaver or larger parts that will not fit existing testers.
Industry News | 2013-05-06 18:13:00.0
Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.
Industry News | 2009-12-30 21:35:34.0
Virtual Industries introduces the Vacula VC-3 heavy duty Vacuum-Tweezer.
Industry News | 2012-09-04 08:51:32.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
Industry News | 2013-06-07 14:37:14.0
Hesse Mechatronics will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.
Industry News | 2013-03-06 10:33:14.0
Hesse Mechatronics (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
Industry News | 2013-03-06 10:36:50.0
Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
Industry News | 2013-04-13 00:16:30.0
Hesse Mechatronics has appointed Michael McKeown as Senior Business Development Manager. Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market.
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