Industry News: packing (Page 6 of 35)

Working with QFNs and QFPs

Industry News | 2018-10-18 09:05:06.0

Working with QFNs and QFPs

Flason Electronic Co.,limited

Via in Pad PCB

Industry News | 2018-10-18 10:38:59.0

Via in Pad PCB

Flason Electronic Co.,limited

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

Nitrogen Protection Reflow Oven

Industry News | 2018-10-18 08:55:30.0

Nitrogen Protection Reflow Oven

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Reballing Preforms Now in 3 Days

Industry News | 2013-09-03 11:52:21.0

BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects

BEST Inc.

High Voltage Reed Relays with interesting packing possibilities to be showcased at Semicon West

Industry News | 2016-06-27 13:38:42.0

Pickering Electronics' newly released Series 67 and 68 Reed Relay range are available for up to 10kV stand-off, 7.5kV switching, with an option of either PCB or flying lead switch connections.

Pickering Electronics

Alcatel and MPower Sign Agreement

Industry News | 2002-04-09 09:16:06.0

For the Development of Innovative Battery Protection ICs

Alcatel

BAE Systems Utilizes VJ Electronix Waffle Pack / Inspection / Counting System to Facilitate Development of New LCS2 Waffle Pack

Industry News | 2021-09-16 06:16:18.0

VJ Electronix, Inc. is pleased to announce that BAE Systems Inc. has been using the XQuik II to solve an industry-wide problem with the industry-standard Waffle Pack design.

VJ Electronix

SemiPack Invests in Additional Hentec/RPS Photon Steam Aging System

Industry News | 2021-05-18 14:19:48.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)


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