Industry News: pad adhesion test (Page 1 of 84)

GPD Global's PCD Technology Is Proven Compatible with Silver-filled Electrical and Thermal Epoxies

Industry News | 2010-12-07 14:53:07.0

GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.

GPD Global

GPD Global Live Demos at IPC APEX in Las Vegas Convention Center

Industry News | 2016-02-27 22:07:08.0

GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.

GPD Global

GPD Global Appoints the Leading Representative Firm in the Southeast

Industry News | 2013-03-12 11:34:11.0

GPD Global has appointed Technical Resources Corporation (TRC) as its representative in Florida, Puerto Rico and the Caribbean.

GPD Global

Jetting Is Redesigned with GPD Global's NEW NCM5000 Dispense Pump

Industry News | 2013-07-22 09:54:27.0

GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.

GPD Global

SMTA International Call for Papers - Deadline Approaches

Industry News | 2003-02-18 09:39:06.0

Encourages You to Submit an Abstract for this Year's Conference

Surface Mount Technology Association (SMTA)

SMTA China Awards Paul Wood ‘The Best Presentation of Vendor Conference One’

Industry News | 2015-04-23 16:30:38.0

Metcal is pleased to announce that SMTA China awarded its Applications Manager, Paul Wood, ‘The Best Presentation of Vendor Conference One’ for the presentation titled “Why Non-Contact Array Solder Clean Up is required.” The award was presented during the SMTA China East 2015 Conference Award Presentation Ceremony on April 22, 2015 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

Nordson ASYMTEK Demonstrates the Helios Dispenser for 1K and 2K Materials for Electronics Manufacturing at Bondexpo 2019

Industry News | 2019-09-13 07:56:55.0

Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at Bondexpo, Stuttgart, Germany, in Hall 6, stand 6425.

ASYMTEK Products | Nordson Electronics Solutions

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Industry News | 2017-09-19 17:02:13.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Dieg

Industry News | 2018-02-12 10:15:49.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2019 in San Diego

Industry News | 2018-08-06 20:44:43.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, January 30, 2019, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

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