Industry News: pad and design (Page 5 of 226)

How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?

Industry News | 2018-10-18 08:34:52.0

How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?

Flason Electronic Co.,limited

Via in Pad PCB

Industry News | 2018-10-18 10:38:59.0

Via in Pad PCB

Flason Electronic Co.,limited

FPGAs and Microcontrollers

Industry News | 2018-10-18 10:34:11.0

FPGAs and Microcontrollers

Flason Electronic Co.,limited

Technical Presentations at the Upcoming SMTA Capital Chapter Expo on August 23rd

Industry News | 2018-08-16 19:58:50.0

The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.

Surface Mount Technology Association (SMTA)

Nordson ASYMTEK Demonstrates the Helios Dispenser for 1K and 2K Materials for Electronics Manufacturing at Bondexpo 2019

Industry News | 2019-09-13 07:56:55.0

Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at Bondexpo, Stuttgart, Germany, in Hall 6, stand 6425.

ASYMTEK Products | Nordson Electronics Solutions

PCB Design and Layout Guidelines

Industry News | 2018-10-18 11:15:12.0

PCB Design and Layout Guidelines

Flason Electronic Co.,limited

IPC/WHMA-A-620 Training and Certification Centers Up and Running

Industry News | 2003-06-18 07:47:47.0

The training certification program, which assures its participants immediate industry recognition, legitimacy and value, is designed to train operators and potential instructors on proper cable and wire harness fabrication and installation.

Association Connecting Electronics Industries (IPC)

World’s Premier Electronics Manufacturing Technical Conference Selects Best International and U.S. Papers Papers to be Presented at IPC APEX EXPO 2012

Industry News | 2012-02-23 14:43:13.0

IPC has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2012. Selected through a ballot process by the event’s Technical Program Committee, the papers will be presented at IPC APEX EXPO, February 28–March 1, at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

Blind and Buried Via Boards

Industry News | 2018-10-18 11:14:24.0

Blind and Buried Via Boards

Flason Electronic Co.,limited

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited


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