Industry News | 2018-09-03 19:54:47.0
IPC announced today the July 2018 findings from its North American Printed Circuit Board (PCB) Statistical Program. Year-over-year growth continued for industry sales and orders. The book-to-bill ratio for July held steady at 1.05.
Industry News | 2018-10-01 20:16:16.0
IPC — Association Connecting Electronics Industries® announced today the August 2018 findings from its North American Printed Circuit Board (PCB) Statistical Program. Year-over-year growth continued for industry sales and orders. The book-to-bill ratio for August held steady at 1.05.
Industry News | 2018-10-02 12:33:11.0
IPC announced today the August 2018 findings from its North American Printed Circuit Board (PCB) Statistical Program. Year-over-year growth continued for industry sales and orders. The book-to-bill ratio for August held steady at 1.05.
Industry News | 2020-10-04 16:19:24.0
IPC Releases PCB Industry Results for August 2020
Industry News | 2011-12-01 13:37:50.0
IPC announced the October findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2009-10-17 09:43:47.0
Reduce PCB Repair Costs
Industry News | 2009-12-02 21:17:33.0
Altium releases smart prototyping peripheral board for its NanoBoard FPGA-based development platforms.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2014-06-05 12:21:18.0
AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.
Industry News | 2012-11-05 19:42:49.0
Mentor Graphics announced the availability of the next-generation PADS® flow with the introduction of PADS 9.5. This release adds usability enhancements, GUI improvements in DxDesigner®, interactive routing updates, and availability in Simplified Chinese language. The scalable PADS 9.5 flow enables users to cost-effectively design their products, from standard PCBs to the industry’s most complex, highest performance, and densest PCBs.
