Industry News | 2010-04-10 23:59:50.0
LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.
Industry News | 2018-10-18 08:34:52.0
How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?
Industry News | 2010-02-15 19:32:28.0
Rosenheim, Germany — February 2010 — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Valts Treibergs and Chris Cuda will present a paper titled “Spring Probe PCB Pad Wear Analysis” at the upcoming Burn-in & Test Socket Workshop, schedule to take place March 7-10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, Ariz.
Industry News | 2011-07-18 12:16:56.0
SinkPAD Corporation’s customer Wild Ideas Light Company today expressed their appreciation for SinkPAD’s PCB cooling technology.
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2017-03-14 10:44:55.0
Developed by XJTAG®, the free software for PADS® Schematic Design will significantly increase the Design for Test and Debug capabilities of the schematic capture and PCB design environment.
Industry News | 2011-10-03 17:04:22.0
Nordson DAGE announces that Kamran Iqbal will present “Measuring the Reliability Risk of PCB Pad Craters” at the SMART Group BGA and Cleaning Reliability Conference.
