Industry News | 2013-09-26 18:03:10.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, March 25–27, 2014 at the Mandalay Bay Convention Center, Las Vegas, Nevada.
Industry News | 2013-11-08 17:12:39.0
ACB is Europe's leading manufacturer of quick-turn and high-reliability prototype and small series PCBs. Typically an early adopter of new and enabling technologies, the company recently took delivery of a top-of-the-range LED-based Direct Imaging (DI) system from Ucamco. Manufactured by Dainippon Screen, Ledia 5 is the PCB industry's fastest DI system, and the only one capable of processing standard soldermask: unique capabilities that, together with ACB's trust in its suppliers, were key to the company's latest investment decision. Working alongside ACB's existing Laser DI system, Ledia 5 handles all ACB's soldermask processing and provides added capacity for dry film exposure. With it, ACB is more flexible and has improved its product quality, yields and capabilities while offering shorter leadtimes for its quick-turn business.
Industry News | 2014-03-20 14:21:26.0
COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance.
Industry News | 2001-02-26 11:18:45.0
Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.
Industry News | 2010-10-26 22:46:06.0
FCT Assembly introduces the new NC676 no-clean leaded solder paste, featuring its latest technology in print and reflow in the no-clean category.
Industry News | 2014-06-05 12:21:18.0
AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.
Industry News | 2009-05-18 17:19:51.0
GREELEY, CO - FCT Assembly debuts WS159 water-soluble solder paste, featuring FCT's latest technology in print and reflow of paste in the water soluble category.
Industry News | 2009-05-20 19:17:30.0
GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.
Industry News | 2015-01-19 21:50:28.0
KYZEN’s innovative new product technology team is introducing its new AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry in Booth #1011 at the IPC APEX EXPO. The EXPO tales place Feb. 24-26, 2015 at the San Diego Convention Center in California.
Industry News | 2015-02-25 14:21:51.0
KYZEN received the 2015 NPI Award for excellence in the category of Cleaning Materials for its AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry. The award was presented during a Tuesday, Feb. 24, 2015 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
