Industry News: pad oxidation (Page 2 of 4)

Lead-free Reflow Profile: Soaking type vs. Slumping type

Industry News | 2018-10-18 08:44:36.0

Lead-free Reflow Profile: Soaking type vs. Slumping type

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

Electronic Components, Parts and Their Function

Industry News | 2018-12-08 03:22:25.0

Electronic Components, Parts and Their Function

Flason Electronic Co.,limited

Solder Joint Encapsulant

Industry News | 2015-05-13 14:00:03.0

The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.

YINCAE Advanced Materials, LLC.

Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes

Industry News | 2014-04-30 13:42:31.0

Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

Indium Corporation

Indium Corporation Features Indium10.1 Pb-Free Solder Paste at SMTAi.

Industry News | 2014-08-05 17:29:07.0

Indium Corporation will feature its new solder paste, Indium10.1, at the SMTAi 2014. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

Indium Corporation

What is a vacuum reflow oven ? What is the difference between vacuum reflow welding and vacuum reflow welding?

Industry News | 2019-12-16 22:35:33.0

Vacuum reflow oven is to conduct high-quality welding for products in a vacuum environment to protect products and solder from being oxidized under the condition of vacuum, and to react the oxide of products and solder surface at the same time to improve the quality of welding surface and reduce the void rate of welding.

Beijing Technology Company

AI Technology, Inc. (AIT) Releases COOL-PAD™ CPR (Conformal Pad) 7154: Second Generation (US Patent 6,496,373).

Industry News | 2014-03-20 14:21:26.0

COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance.

AI Technology, Inc. (AIT)

Thermaltronics’ Tips to Improve Soldering Tip Life and Reduce Cost

Industry News | 2018-10-09 18:31:30.0

Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.

Thermaltronics USA, Inc.


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