Industry News: pad peel (Page 1 of 1)

IPC Presents Technical Education Course: PCB Troubleshooting Course held in conjunction with PCB Carolina

Industry News | 2016-09-14 17:44:33.0

IPC – Association Connecting Electronics Industries® will present “PCB Troubleshooting” on November 2, 2016 in Raleigh, N.C. in conjunction with regional trade show, PCB Carolina.

Association Connecting Electronics Industries (IPC)

IPC Honors Best Papers at IPC APEX EXPO� 2009

Industry News | 2009-04-15 23:01:13.0

BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.

Association Connecting Electronics Industries (IPC)

Flextac Self-Adhesive Stencils Simplify BGA Rework

Industry News | 2001-02-26 11:18:45.0

Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.

Circuit Technology Center, Inc.

UVLED application burst buffer period, the urgent matter of the moment is to start the technical war

Industry News | 2019-12-16 22:05:41.0

In recent years, as a subdivision of the LED industry, UV LED industry has developed in full swing. In 2019, the UV LED industry is in the buffer phase of application explosion, and the most urgent task for relevant companies is to launch the technology war, in order to capture as many places as possible before the real market explosion.

Beijing Technology Company

Henkel Product Development Expertise Rewarded at APEX

Industry News | 2010-04-16 01:50:52.0

Building on a rich history of industry honors and product accolades, Henkel Corporation was once again recognized for its innovation initiatives at the recent APEX event in Las Vegas, Nevada. Two of the company’s most recent product advances, Loctite PowerstrateXtreme Printable (PSX-P) and Hysol ECCOBOND CA3556HF, were at the top of the leaderboard for two well-established honors programs.

Henkel Electronic Materials

MacDermid Alpha Presents 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at SNEC 2021 in Shanghai, China

Industry News | 2021-05-21 03:59:59.0

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at the SNEC 15th(2021) International Photovoltaic Power Generation and Smart Energy Conference &Exhibitiontaking placein Shanghai, China on June 2-5,2021.

MacDermid Alpha Electronics Solutions

January 25-27, San Diego, CA – Booth 1100

Industry News | 2022-01-10 16:28:20.0

Once again, customers looking for leading-edge test solutions can come to Seica's booth 1100 and view the future of Flying Probe test in the form of the new PILOT VX platform. Fast, Powerful and Smart: the Pilot VX raises the bar of flying probe test performance, with cutting-edge solutions that address the fundamental concerns of electronic board manufacturers looking to optimize their investment.

SEICA SpA

Press Release for Apex 2023

Industry News | 2023-01-16 07:16:27.0

Customers looking for leading-edge test solutions can come to Seica's booth 2511 and view the newest line of Flying Probe test on the market in the form of the PILOT VX platform, bed of nails ICT solutions, the Compact LR, and Mini200 and the latest conformal coat inspection systems, the Dragonfly.

SEICA SpA

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