Industry News | 2008-04-08 22:36:16.0
MORRISVILLE, NC - April 2, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces it was named as a first finalist for its OPASS technology in the Design and Manufacturing Software category during the VISION Awards announcement ceremony that took place Wednesday, April 2, 2008 in Las Vegas during APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2008-04-08 23:53:03.0
MORRISVILLE, NC - April 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it won a 2008 SMT China Vision Award for its OPASS technology in the Software - Production category during an awards ceremony that took place April 8, 2008 at the Shanghai Everbright Convention & Exhibition International Hotel during NEPCON China/EMT China. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2011-10-03 17:04:22.0
Nordson DAGE announces that Kamran Iqbal will present “Measuring the Reliability Risk of PCB Pad Craters” at the SMART Group BGA and Cleaning Reliability Conference.
Industry News | 2012-05-01 19:12:41.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit its 4000Plus Bondtester Pad Cratering Inspection System in Booth #212 at the upcoming Electronic Components and Technology Conference
Industry News | 2010-02-15 19:32:28.0
Rosenheim, Germany — February 2010 — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Valts Treibergs and Chris Cuda will present a paper titled “Spring Probe PCB Pad Wear Analysis” at the upcoming Burn-in & Test Socket Workshop, schedule to take place March 7-10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, Ariz.
Industry News | 2012-07-31 15:57:01.0
Printable, formable conductive inks that can be applied to a flat plastic substrate and then molded into various shapes offer exciting new opportunities to engineers and designers trying to incorporate internal electronic circuitry into molded automotive and aircraft interior parts, as well as a wide variety of industrial and consumer electronic assemblies...
Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Industry News | 2018-10-18 08:34:52.0
How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?
Industry News | 2009-11-24 22:09:36.0
Screen printing and mass imaging world leader DEK chose Productronica earlier this month to launch Sentinel, a breakthrough productivity-enhancing solution that lowers the cost of achieving more good boards from the stencil printing process.
Industry News | 2008-03-20 21:06:04.0
First unveiled at the end of 2007 during Productronica, DEK�s Instinctiv� V9 machine control software has now added more functionality since its initial debut. The award-winning user interface now incorporates enhanced control of its revolutionary HawkEye� post-print inspection technology, making paste on pad verification even faster and easier.
