Industry News | 2023-07-22 11:28:46.0
If need more technical support , pls contact with us at Jenny@ksunsmt.com
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Industry News | 2009-04-15 23:01:13.0
BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Industry News | 2013-01-14 08:41:05.0
OK International will debut the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth #735 at the upcoming IPC APEX EXPO
Industry News | 2013-02-27 15:04:56.0
February 2013 ― OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth E22 at the Enova Grand Ouest exhibition, scheduled to take place March 27-28, 2013 in Rennes, France.
Industry News | 2012-05-30 18:23:07.0
IPC Midwest Conference & Exhibition™ will highlight advances in assembly materials, assembly processes and reliability testing to help electronics companies address critical challenges in manufacturing defect-free, quality electronics
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2004-09-07 18:32:13.0
NORTHBROOK, Ill., September, 2004
Industry News | 2017-05-11 17:06:16.0
Library Expert Lite automatically builds footprints and 3D STEP models for tens of millions of parts, for free.
