Industry News | 2010-03-22 14:13:32.0
MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE) announces that it will feature its latest inspection equipment in booth 2271 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2010-05-26 13:33:03.0
MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE), a leading SMT inspection solutions provider, announces that it will highlight its QX500™, SE350™ and SE500™ in booth 3D-03 at the upcoming JISSO PROTEC exhibition, which is scheduled to take place June 2-4, 2010 at the Tokyo Big Sight in Japan.
Industry News | 2012-06-27 14:07:07.0
PRIDE Industries, Inc has purchased two SE500™ 3-D Solder Paste Inspection (SPI) systems for its manufacturing facility in Roseville, CA.
Industry News | 2009-03-10 18:41:17.0
MINNEAPOLIS - January 2009 - CyberOptics Corporation (Nasdaq: CYBE) announces that it will introduce SE500, an advanced 100 percent 3-D solder paste inspection system, in booth 2071 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2010-03-27 13:42:03.0
MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE) announces that it will introduce its newest SPI and AOI systems in booth 2271 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2010-08-23 14:30:41.0
CyberOptics Corporation (NASDAQ: CYBE) will feature its award winning AOI and SPI In-Line inspection Systems at GlobalTRONICS 2010 scheduled to take place from September 13 - 15, 2010 at Sands Expo and Convention Centre, Hall A in Singapore.
Industry News | 2010-11-15 22:18:42.0
CyberOptics announces that Hyundai Mobis has invested in the SE500™ 100 percent 3-D solder paste inspection system for its Tianjin plant. Hyundai Mobis' investment totals approximately US$500K.
Industry News | 2009-11-11 12:33:23.0
MINNEAPOLIS - November 2009 - CyberOptics Corporation (Nasdaq: CYBE) announces that it has been awarded a Global Technology Award in the category of Best North American Product for its SE500 3-D Solder Paste Inspection system. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.
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