Industry News: pad sizes (Page 8 of 19)

PARMI Accepts an NPI Award at APEX for its New SIGMA X SPI System

Industry News | 2014-03-26 12:46:54.0

PARMI announces that it has been awarded a 2014 NPI Award in the category of Test & Inspection – SPI for its SIGMA X series solder paste inspection system.

PARMI

Surface-mount technology

Industry News | 2018-10-18 09:15:23.0

Surface-mount technology

Flason Electronic Co.,limited

Indium Corporation Features Ultra-Low Voiding Solder Paste at Productronica

Industry News | 2007-10-23 17:27:36.0

Indium Corporation�s *Indium5.1AT Pb-Free Solder Paste *is an Award-Winning No-Clean, Pb-Free Solder Paste that delivers enhanced finished goods reliability by featuring;

Indium Corporation

Practical Components Designs Custom PC Practice Kits and Boards

Industry News | 2010-06-23 13:42:53.0

Practical Components, a leading international supplier of solder training kits and materials, mechanical IC samples or “dummy” components and SMD production tools and equipment, announces the capability to design custom practice PC boards or complete kits.

Practical Components, Inc.

SHENMAO to Showcase Advanced Automotive Electronic Solutions at 2024 IPC APEX EXPO

Industry News | 2024-03-18 12:35:19.0

SHENMAO Technology will exhibit its cutting-edge solutions for automotive electronics at Booth 2639 during the upcoming IPC APEX EXPO 2024. Taking place April 9-11, 2024 at the Anaheim Convention Center in California, the expo will provide an opportunity for industry professionals to explore SHENMAO's latest advancements in solder paste technology.

Shenmao Technology Inc.

Rocket EMS Purchases PARMI’s SIGMA X Series SPI System  

Industry News | 2014-11-06 12:58:26.0

Rocket EMS Inc. today announced that it has purchased a SIGMA X series solder paste inspection system from PARMI.

Rocket EMS

DEK and PacTech Join Forces for High-Volume Wafer Bumping Solution

Industry News | 2003-06-13 10:10:58.0

By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.

ASM Assembly Systems (DEK)

Amkor ULTRA CSP� Test Die

Industry News | 2002-09-17 15:09:18.0

Practical Dummy Components

Practical Components, Inc.

FUJI NXT label feeder NXT II NXT III M3 M6 electric feeder FS-LB-NXT-50

Industry News | 2022-07-11 09:07:53.0

FUJI NXT label feeder NXT II NXT III M3 M6 electric feeder FS-LB-NXT-50 FS label feeder can be used for All FUJI pick and place NXT and AIMAX equipment. Saving the cost of single-purchasing labeling equipment and workshop space;

Shenzhen FS equipment CO.,LTD

The Design Principles of Stencil Apertures

Industry News | 2018-10-18 10:24:05.0

The Design Principles of Stencil Apertures

Flason Electronic Co.,limited


pad sizes searches for Companies, Equipment, Machines, Suppliers & Information

One stop service for all SMT and PCB needs

Training online, at your facility, or at one of our worldwide training centers"
Pillarhouse USA for handload Selective Soldering Needs

High Throughput Reflow Oven
Sell Your Used SMT & Test Equipment

High Resolution Fast Speed Industrial Cameras.
Professional technical team,good service, ready to ship- Various brands pick and place machine!

Internet marketing services for manufacturing companies