Industry News | 2009-03-18 17:08:59.0
FINETECH will demonstrate today's most requested advanced rework applications in booth #2059 at the upcoming APEX 2009, scheduled to take place March 31 � April 2, 2009 at the Mandalay Bay Convention Center in Las Vegas.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2007-02-23 06:14:49.0
Alpharetta-based company continues strong growth in the military/space sector
Industry News | 2018-10-18 09:29:21.0
Wave soldering welding interview direct contact with high temperature liquid in the production
Industry News | 2010-11-30 13:30:04.0
Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods.
Industry News | 2015-01-20 23:40:52.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present two SMTA webtorials on Feb. 10 and 17. Dr. Lee's presentation, Electromigration-The Hurdle for Miniaturization and High Power Devices, discusses critical aspects regarding the electromigration of solder joints, including failure mechanisms, the effect of solder alloy composition, solder joint metallurgy and configuration, pad design and composition, current density, temperature, and current polarity.
Industry News | 2010-10-26 22:46:06.0
FCT Assembly introduces the new NC676 no-clean leaded solder paste, featuring its latest technology in print and reflow in the no-clean category.
Industry News | 2021-08-26 11:02:27.0
SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
Industry News | 2011-07-27 22:46:46.0
SinkPAD Corporation’s Vice President of Marketing and Business development Sam Bhayani has announced that his company SinkPAD Corporation will be performing comparative thermal profiling right at their booth (#264) next week at the LED show in Las Vegas July 27th.
