Industry News: pad solder (Page 10 of 51)

CableEye® Micro-Match™ Connector Board, CB49

Industry News | 2016-03-09 11:23:40.0

CAMI Research Inc. (Acton, MA) announces a new board for its CableEye cable and harness testing systems. Populated with solder pads to accept a suite of TE-Connectivity™ Micro-MaTch connectors, the board addresses markets plagued by vibration and fretting corrosion, and requiring “miniaturized connectivity”. Rated to 500Vdc/350Vac, the CB49 may be used on all CableEye models.

CAMI Research Inc.

CableEye® Generic Surface Mount & TH Board, CB51

Industry News | 2016-10-11 13:26:07.0

CAMI Research Inc. (Acton, MA) announces another new board for its CableEye cable and harness testing systems. Populated with solder pads to accept both aligned and staggered, 1.25mm and 1.5mm pitch, surface mount and through hole (TH) connectors, the board addresses any market with a demand for board-to-board connections. Rated to 700Vdc/500Vac, the CB51 may be used on all CableEye models.

CAMI Research Inc.

Knowledge about PCB Panelization

Industry News | 2019-11-05 22:24:42.0

Designing a PCB for automatic assembly and full production runs requires a few design changes from an initial prototype PCB run. Today most PCBs are assembled and tested with automated machines from the data from PCB drawing files. With up to 80% of a new product's cost determined by the first prototype build, avoiding late changes and designing with manufacturing in mind can have a significant impact on the product cost, reliability, and yield of a PCB design. Luckily, if some good choices are made early in the design process, designing a PCB for manufacturing is relatively straight forward with few pitfalls.

Headpcb

Via in Pad PCB

Industry News | 2018-10-18 10:38:59.0

Via in Pad PCB

Flason Electronic Co.,limited

Exposed Vias in BGA Pads

Industry News | 2018-10-18 10:26:46.0

Exposed Vias in BGA Pads

Flason Electronic Co.,limited

SN100CL Minimum Thickness Guidelines

Industry News | 2008-09-10 09:31:07.0

Saturn Electronics Corp. Providing Criteria for the Industry

Saturn Electronics Corporation

New High Thermal & Impact Reliability Solder and Water Soluble Flux from SHENMAO

Industry News | 2018-06-03 19:11:33.0

SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.

Shenmao Technology Inc.

Stencil aperture considerations for QFN chips

Industry News | 2018-10-18 08:40:47.0

Stencil aperture considerations for QFN chips

Flason Electronic Co.,limited

Indium Corporation Wins Global Technology Award

Industry News | 2006-09-29 17:32:14.0

Indium Corporation was recognized with the Global Technology Award for its Indium5.1AT Pb-Free Solder Paste

Indium Corporation

Wild Ideas Light Company lauds SinkPAD’s new technology

Industry News | 2011-07-18 12:16:56.0

SinkPAD Corporation’s customer Wild Ideas Light Company today expressed their appreciation for SinkPAD’s PCB cooling technology.

SinkPAD Corporation


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