Industry News | 2021-10-31 04:57:58.0
Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.
Industry News | 2022-01-03 07:38:59.0
Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2011-03-21 13:00:44.0
KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces an opportunity to win an Apple iPad2 by beating its award-winning Auto-Prediction Navigator Profiling Software. All participants will receive a certificate for a free upgrade to Navigator Power, a $975 value*!
Industry News | 2018-10-18 09:46:58.0
Analysis of how to spot welding process
Industry News | 2011-08-22 20:19:21.0
KIC announces an opportunity to win an Apple iPad2 by beating its award-winning Auto-Prediction Navigator Profiling Software. All participants will receive a certificate for a free KIC Navigator or Auto-Focus Power upgrade, a $975 value*!
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2010-09-27 23:15:26.0
VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2022-08-14 14:26:09.0
SHENMAO America, Inc. offers PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
