Industry News: pad to pad for wave solder (Page 10 of 38)

Nihon Superior to Highlight SN100C Products at SMTAI 2009

Industry News | 2009-09-17 15:06:04.0

OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 624 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA.

Nihon Superior Co., Ltd.

SEHO PowerWave: The Powerful System for Medium to Large Production Volumes

Industry News | 2017-05-10 18:01:37.0

SEHO Systems GmbH today announced plans to exhibit in Stand 7E048 at Electronics & Applications, scheduled to take place May 30-June 1, 2017 in Utrecht, Netherlands. SEHO’s representative KVMS will demonstrate the PowerWave 4.0 wave soldering system, which is ideally suited for medium to large production series.

SEHO Systems GmbH

Vitronics Soltec USA to Introduce New YouTube Channel at IPC APEX 2012

Industry News | 2012-02-22 16:08:53.0

Vitronics Soltec USA will introduce its new YouTube channel at their booth (3509) at the IPC APEX 2012 trade show in San Diego, CA. The new channel will initially feature several animations that highlight key features and functions of each of Vitronics Soltec's three soldering machine types: wave, selective, and reflow.

Vitronics Soltec

Nihon Superior to Showcase the Newest Addition to the SN100C Lead-Free Solder Series at the 2012 IPC APEX Expo

Industry News | 2012-01-21 16:28:10.0

Nihon Superior will introduce the newest addition to its SN100C lead-free solder series in Booth #3044 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

Nihon Superior Co., Ltd.

Nordson DAGE Announces Further Orders for Its Unique Patented Hot Pin Pull Test Method on the 4000Plus Bondtester The only system that fully complies with IPC-9708 test standards

Industry News | 2014-11-18 18:10:25.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.

Nordson DAGE

Exposed Vias in BGA Pads

Industry News | 2018-10-18 10:26:46.0

Exposed Vias in BGA Pads

Flason Electronic Co.,limited

SEHO Systems to Showcase the Ideal Starter System for Automated Wave Soldering at IPC Midwest 2011

Industry News | 2011-08-22 19:11:45.0

SEHO North America will showcase the redesigned GoWave in Booth #113 at the upcoming IPC Midwest Conference & Exhibition.

SEHO Systems GmbH

Nordson DAGE to Bring Solutions for Live Imaging and Demanding Applications to SMT/Hybrid/Packaging

Industry News | 2013-03-20 10:54:36.0

Nordson DAGE, announces it will exhibit in Booth # 7-224 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

Nordson DAGE

Parvus Unveils Three Fanless 800MHz Pentium III PC/104-Plus CPU Modules Designed for -40C to +85C Extended Temperature

Industry News | 2005-07-11 12:52:53.0

Parvus now offers low-power Intel Pentium III-based architecture in three new ruggedized PC/104-Plus CPU boards, the SpacePC 1460, 1461 and 1463

Parvus Corporation

Nihon Superior to Exhibit at Productronica India 2011

Industry News | 2011-09-01 21:35:02.0

Nihon Superior (Singapore) Pte. Ltd., subsidiary of Nihon Superior Co. Ltd. will showcase a new, expanded range of SN100C products in booth 1060 at the upcoming Productronica India 2011 exhibition

Nihon Superior Co., Ltd.


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