Industry News: panasonic flip chip bonder (Page 1 of 6)

Baja Bid Online Auction – June 3-5, 2014 (Featuring Items From OneChip Photonics)

Industry News | 2014-05-22 15:42:29.0

Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.

Baja Bid

OneChip Photonics Facility In Canada Closing – All Assets Being Sold

Industry News | 2014-06-03 13:04:15.0

The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.

Baja Bid

Panasonic Flip Chip Bonder to Make North American Debut at Semicon

Industry News | 2014-06-25 12:31:01.0

Panasonic Factory Solutions Company of America will debut a process-flexible flip chip bonder at this year’s Semicon West as part of its high-speed, low-cost manufacturing solutions for highly advanced devices.

Panasonic Factory Solutions Company of America (PFSA)

Panasonic’s New Process-flexible Flip Chip Bonder Garners Interest of NA High-Reliability Manufacturers at Semicon

Industry News | 2014-07-29 12:36:04.0

Panasonic Factory Solutions Company of America’s new process-flexible, flip chip bonder garnered the interest of North American high-reliability manufacturers—from photonics to high frequency devices—at Semicon West 2014.

Panasonic Factory Solutions Company of America (PFSA)

Hesse & Knipps is now Hesse Mechatronics.

Industry News | 2013-03-06 10:33:14.0

Hesse Mechatronics (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.

Hesse Mechatronics

Hesse & Knipps is now Hesse Mechatronics

Industry News | 2013-03-06 10:36:50.0

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.

Hesse Mechatronics

Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise Costs

Industry News | 2009-12-22 10:09:22.0

Pressurex® Sensor Film Needed to Measure Contact Pressure Variations Across Flip Chip Dies and Bonding Tools

Sensor Products Inc.

Hesse & Knipps Appoints Prospect Technical Sales as Rep throughout Northwest United States and Canada

Industry News | 2012-08-02 11:15:11.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has strengthened its customer support and wedge bonder representation throughout Northwestern United States and Canada with the appointment of Prospect Technical Sales that will now support the company’s family of wedge bonders in Nevada, Oregon, Washington, Montana, Utah, Colorado, Northern California as well as the Canadian provinces of British Columbia and Alberta.

Hesse Mechatronics

New Dual-Head Wedge Bonder Makes Americas Debut

Industry News | 2013-06-07 14:37:14.0

Hesse Mechatronics will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.

Hesse Mechatronics

Hesse Mechatronics, Inc. Appoints Senior Business Development Manager

Industry News | 2013-04-13 00:16:30.0

Hesse Mechatronics has appointed Michael McKeown as Senior Business Development Manager. Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market.

Hesse Mechatronics

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