Industry News: parallel gap bonder (Page 1 of 2)

Palomar Introduces New Automatic

Industry News | 2003-05-05 09:13:55.0

Reliable Wire Bonders for High Yield Production

Palomar Technologies

Tresky’s Product Technologies Provide High-Quality Solutions for Microelectronics

Industry News | 2013-06-20 19:31:51.0

Tresky, announces that its wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable solutions for many applications within the microelectronics industry.

Tresky AG

Panasonic Flip Chip Bonder to Make North American Debut at Semicon

Industry News | 2014-06-25 12:31:01.0

Panasonic Factory Solutions Company of America will debut a process-flexible flip chip bonder at this year’s Semicon West as part of its high-speed, low-cost manufacturing solutions for highly advanced devices.

Panasonic Factory Solutions Company of America (PFSA)

Tresky Holds Successful Showing at iMAPS 2013, Appoints 3 New Reps

Industry News | 2013-10-18 07:35:36.0

Tresky announces that iMAPS The 46th International Symposium on Microelectronics, held in Orlando, FL from September 30-October 3, 2013, was a fruitful and exciting show.

Tresky AG

Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise Costs

Industry News | 2009-12-22 10:09:22.0

Pressurex® Sensor Film Needed to Measure Contact Pressure Variations Across Flip Chip Dies and Bonding Tools

Sensor Products Inc.

Semikron Checks DCBs with Automatic Wirebond AOI from Viscom

Industry News | 2013-03-07 11:20:46.0

Semikron (SEMIKRON International GmbH) manufactures components and systems for power electronics.

Martel Marketing Communications, Inc.

Plasmabrush – cold-active atmospheric-pressure plasma tool

Industry News | 2009-12-08 14:46:58.0

Whether coating, bonding, casting, printing or foaming is concerned – optimum and permanent adhesion can only be achieved with many substrates if the surface is pre-treated. The cold-active plasma beam of the patented Plasmabrush technology developed by Reinhausen Plasma opens up a whole range of new application possibilities for industrial processes under ambient pressure. Even temperature-sensitive substrates and thin-walled, fine and complex contours can be treated efficiently in a process that is both reliable and environmentally sound.

Reinhausen Plasma GmbH

Great Results from Europe’s First atom Platform Installation at Syselec France.

Industry News | 2018-07-15 12:49:50.0

Contract manufacturer Groupe Syselec, based near Toulouse in France, is the first Europlacer customer in Europe to install a placement machine from the award-winning new atom platform range. Having placed its order for an atom3 machine last summer, while the platform was still in the final stage of development, Syselec was in fact the first customer on Europlacer’s worldwide atom order book.

EUROPLACER

Nordson's Solutions for SMT Technology and Electronics Manufacturing Demonstrated at NEPCON ASIA 2021

Industry News | 2021-11-03 13:30:59.0

Products for conformal coating, dispensing, plasma treatment, curing, selective soldering, and X-ray inspection were showcased

Nordson Corporation

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