Industry News: parts express passive components (Page 18 of 27)

New Yorker Electronics Unveils CDE's new VMF & VPF Electronic Hybrid Supercapacitor Series

Industry News | 2021-02-11 13:28:05.0

New Cornell Dubilier Electronics' Hybrid LIC Supercapacitors Deliver up to 220 Farads at 3.8 Volts

New Yorker Electronics

New Yorker Electronics Distributes Exxelia Miniature Low-Pass Filter Capacitors

Industry News | 2020-12-21 09:11:22.0

Several Ranges of Miniature Filters with Different Low-pass Configurations were designed to Protect Electronic Equipment from Interferences

New Yorker Electronics

Electro Scientific Industries Announces Executive Termination

Industry News | 2003-06-10 08:48:16.0

ESI announced today that it has terminated the employment of James Dooley

Electro Scientific Industries

Universal's Innova Feeder Delivers High-Speed Bare Die to Mainstream Manufacturing

Industry News | 2011-03-21 10:39:09.0

Universal Instruments is embracing the convergence era of electronics assembly with the introduction of the Innova and Innova + direct die feeders. This revolutionary technology enables the presentation of wafer-level devices to Universal's GenesisSC Platform without incurring costly packaging charges.

Universal Instruments Corporation

Viscom’s S3088 SPI Will Be Part of the NPL Solder Paste and Solder Joint Automatic Inspection Experience at SMTAI

Industry News | 2015-09-23 16:47:32.0

Viscom announced today that its S3088 SPI system will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor. This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly.

Viscom AG

NexLogic Technologies, Inc. Implements Averatek's Breakthrough Aluminum Soldering Process

Industry News | 2021-07-15 03:48:30.0

Averatek is pleased to announce that NexLogic Technologies, Inc. has implemented soldering to aluminum using Averatek's Mina™ chemistry. Mina™ is a breakthrough new pretreatment that allows for soldering to aluminum as easily as to copper with significant benefits over traditional methods of soldering to aluminum.

Averatek Corporation

Electronica 2022 November 15-18, Munich, Germany – Booth A3-459 Seica powerful FLYLAB

Industry News | 2022-11-15 12:44:31.0

The powerful Flylab software is a laboratory tool realized inside a Flying probe tester thanks to a simplified and intuitive environment, it provides through the flying probes a complete set of instruments, always available to the user, that allow to perform stimulus and measurements on the UUT in the prototyping stage.

SEICA SpA

Mentor Graphics Unveils Comprehensive Design Tool Flow to Address Challenges of Designing Complex FPGAs

Industry News | 2003-05-27 08:20:51.0

Extends from high-level FPGA design through Printed Circuit Board (PCB) design

Mentor Graphics

Informative & Interactive - PCB webinars from Würth Elektronik

Industry News | 2014-01-22 10:22:19.0

Internet access and one free hour - that's all you need to take part in an interactive webinar from Würth Elektronik. Once a month, special-ists in PCB manufacturer present a topic relating to the product range. Previously, we have addressed questions on HDI technology, the different advantages of semi-flex and rigid-flex printed circuit boards or how to use thermal management effectively.

Würth Elektronik GmbH & Co. KG


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