Industry News: passive component recommended footprint (Page 2 of 8)

Eliminating Latency in Next Gen WiFi 6E Devices

Industry News | 2020-11-04 09:13:07.0

Advanced High-Q RF components will play a critical role in larger goal of eliminating many of the latency issues of the past

Johanson technology

Android(TM) Operating System Controls New Benchtop Reflow Oven

Industry News | 2014-03-25 18:52:14.0

An innovative Android-based operating system and high-resolution touchscreen user interface only begin to explain why Manncorp’s new MC-301 Benchtop Reflow Oven is among its hottest new products for 2014. By simulating the environment of an inline reflow system in a small footprint, the MC-301 is ideal for prototyping, manufacturability testing, and even short-run batch production. Its exclusive Android control app allows surface mount assemblers and product developers to meet solder paste manufacturers’ precise specifications for the preheat, soak, reflow, and cooling phases of their recommended profiles. Heating and cooling rates in each stage are also automatically calculated to easily verify compliance with component and material requirements.

Manncorp

Computer-Controlled Batch Reflow With Real-Time Profiling Mimcs Inline Reflow

Industry News | 2012-09-20 13:26:42.0

Electronics assemblers who need to produce prototypes, pre-production boards and other small batch/short-run jobs in-house can now get inline reflow results in a small footprint, at an affordable price-now with full computer control.

Manncorp

Inovaxe Appoints Yankee Soldering as Its New England Rep

Industry News | 2016-02-21 12:24:32.0

Inovaxe announces the appointment of Yankee Soldering as its manufacturers’ representative for New England. Based in Rhode Island, Yankee soldering will represent Inovaxe in Rhode Island, Connecticut, Massachusetts, Maine, Vermont and New Hampshire.

Inovaxe Corporation

New Vishay 30V Power Stage MOSFET Designed for Power Conversion in Computing and Telecom Applications

Industry News | 2020-12-18 11:36:37.0

New SiZF300DT 30V MOSFET Half-Bridge Power Stage with Integrated Schottky Diode Delivers 11% Higher Output Current than Other Solutions

New Yorker Electronics

Practical Components Offers Amkor TMV® PoP (Package on Package) Daisy Chain Components

Industry News | 2011-01-05 17:46:58.0

Practical Components Inc. announced the availability of daisy chain samples of Amkor Technology, Inc.’s TMV® PoP (Package on Package) solution.

Practical Components, Inc.

ATE Spring Pin BGA Socket for Digital Camera Processor

Industry News | 2011-01-12 15:27:11.0

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing digital camera processor - CBT-BGA-7005. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 500,000 insertions.

Ironwood Electronics

Stamped Spring Pin BGA Socket for IDT's FCBGA144

Industry News | 2011-03-22 16:23:31.0

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for BGA devices - CBT-BGA-6014.

Ironwood Electronics

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

Practical Components' TMV PoP to Be Featured on Live Assembly Line at NEW 2011

Industry News | 2011-04-07 11:31:09.0

Practical Components announces that its dummy components have been invited to be part of the "Future Proof Assembly Line" at the upcoming National Electronics Week exhibition, which is scheduled to take place April 12-13, 2011 at NEC Birmingham, United Kingdom.

Practical Components, Inc.


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