Industry News: passive component shear test (Page 16 of 22)

New Yorker Electronics Releases Full Line of New Adam-Tech Rocker Switches

Industry News | 2022-09-27 15:21:17.0

New Line for New Yorker Electronics offers Standard and LED Lighted Actuators are available in Multiple Colors, Shapes and Markings

New Yorker Electronics

JTAG Technologies Targets Functional Testers

Industry News | 2011-09-12 15:45:51.0

JTAG Technologies is pleased to announce the immediate release of a new JTAG/boundary-scan hardware interface product compatible with the MAC-Panel ‘Scout’ mass interconnect system. The JT 2147/DAK is a signal conditioning module that allows seamless connections from JTAG Technologies PXI DataBlaster to the Scout’s connection system.

JTAG Technologies B. V.

Newly Upgraded Vishay Power MOSFET is Improved for Automotive Applications

Industry News | 2021-01-05 11:01:03.0

New Vishay Siliconix 40V Automotive Grade MOSFET Provides Lower Thermal Resistance and a Lead Frame for Extended Board-Level Reliability

New Yorker Electronics

Fraunhofer Report Affirms Superior Performance of Ovation�s HD Grid-Lok� Board Support Technology

Industry News | 2008-07-08 23:14:59.0

Bethlehem, PA - The results of a study conducted by the well-respected Fraunhofer Institute and commissioned by leading German electronics distributor, Ben Technologies, have confirmed that Ovation Products� HD Grid-Lok reconfigurable tooling technology is an extremely robust and cost-effective support solution for modern electronics production.

Ovation Products

Multek certified on Shocking Technologies’ unique ESD protection solution

Industry News | 2011-06-16 13:42:41.0

Shocking Technologies announced that Multek, a wholly owned subsidiary of Flextronics, has been certified to manufacture printed circuit boards (PCBs) with Shocking Tech’s innovative Voltage Switchable Dielectric™ (VSD) material. The certification is the result of extensive collaboration between the two companies and successful testing of Shocking Tech’s XStatic™ VSD material into PCBs manufactured by Multek.

Shocking Technologies, Inc.

Adept Technology Previews Photonics Assembly Solutions At Fiber Optic Industry Conference

Industry News | 2001-09-13 08:52:49.0

Epoxy Bonding and Laser Welding Machines Integrate Adept Controls, Precision Stages and Sensing

Adept Technology Inc.

Juki Automation Systems to Showcase IFS-X2 Intelligent Feeder System at Nepcon East 2008

Industry News | 2008-04-19 14:15:14.0

MORRISVILLE, NC - April 2008 - Juki Automation Systems, a world-leading provider of automated assembly products and systems, announces that it will display the IFS-X2 RFID intelligent feeder system with traceability in booth 817 at the upcoming Nepcon East exhibition and conference, scheduled to take place April 30-May 1, 2008 at the Boston Convention & Exhibition Center in Boston.

Juki Automation Systems

Juki Automation Systems to Showcase IFS-X2 Intelligent Feeder System at APEX 2009

Industry News | 2009-03-23 13:22:27.0

MORRISVILLE, NC - March 2009 - Juki Automation Systems, a world-leading provider of automated assembly products and systems, announces that it will display the IFS-X2 RFID intelligent feeder system with traceability in booth 759 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

Juki Automation Systems

STI’s Engineering Experts to Present at SMTAI 2009

Industry News | 2009-09-17 14:35:25.0

MADISON, AL — September 2009 — STI Electronics Inc., a full service organization providing training, electronic and industrial sales and distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Jim D. Raby, P.E., Mark McMeen, V.P. of Engineering Services, and Casey H. Cooper, Electrical Engineering Manager will give a presentation titled “Imbedded Die Assembly Process, Is It Ready Yet?” at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego. The presentation will be held during session ET3 titled, “System in Packaging (SiP), which is scheduled to take place Monday, October 5, 2009 from 1-2:30 p.m. in the California room.

STI Electronics


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