Industry News: passive component shear test (Page 6 of 22)

Labtech Microwave launch range of passive components

Industry News | 2008-05-29 10:59:04.0

One of the UK's leading design and manufacturers of standard and bespoke microwave technology has launched a series of passive components aimed at the satellite, commercial, radio and air traffic communications industries as well as test and measurement.

Labtech Microwave

Post-Assembly Test for PCBs - Multitest expands test capacities for fully assembled load boards

Industry News | 2011-09-07 18:25:57.0

Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, has expanded its post-assembly, flying probe test capacity to meet the growing demands of PCB assembly.

Multitest Elektronische Systeme GmbH

Vi TECHNOLOGY®'s component inspection solutions to reduce defective PCBAs @ Nepcon Shenzhen 2010

Industry News | 2010-08-09 13:23:20.0

Vi TECHNOLOGY will be represented with its Chinese Agents to exhibit AOI solutions to reduce defective PCBAs at Nepcon South China Shenzhen from August 31st to September 2nd.

Vi TECHNOLOGY

Averatek to Present "Reliability of Solder Joints on Flexible Aluminum PC Boards" at SMTAI

Industry News | 2021-10-07 15:38:24.0

Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."

Averatek Corporation

Circuit Technology Center Commissions New XRF X-ray System

Industry News | 2021-08-13 08:37:00.0

Circuit Technology Center announces that it has recently purchased and commissioned an Oxford 980 X-Strata series XRF (x-ray fluorescence) system to support the testing of electronic components for restricted substances such as lead or tin above specified limits. The system can also verify the coating thickness. Defense base customers often require XRF verification testing of components after components have been processed through lead-free to leaded solder alloy exchange for tin mitigation applications. XRF testing may also be required to verify RoHS compliance of components that have been re-balled or re-processed for lead-free applications. In addition to XRF testing, Circuit Technology Center also supports ionic cleanliness testing, X-ray, Acoustic Microscopy, Solderability, and BGA ball shear testing services.

Circuit Technology Center, Inc.

New Yorker Electronics to distribute Gowanda Ceramic Wirewound Chip Inductor Series

Industry News | 2021-05-21 14:09:53.0

Gowanda's Space/Aero Chip Inductors provide Lower Power Consumption in High Frequency Applications

New Yorker Electronics

NPL 2017 Free Webinars are Launched and Chaired by Bob Willis

Industry News | 2016-12-12 05:28:06.0

The following webinars are available free online throughout 2017 and are organised by Bob Willis for NPL. A direct link is provided for each event to allow you to book online

ASKbobwillis.com

More BGA Defect Examples Available Royalty FREE

Industry News | 2017-01-05 04:27:37.0

BGA Inspection & Defect Photo Album (Can be downloaded) The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:

ASKbobwillis.com

ESI Introduces Embedded Passive Laser Trimming System

Industry News | 2002-03-29 08:00:13.0

Allows Manufacturers to Achieve Tighter Tolerances and Increase Functionality

Electro Scientific Industries

Averatek to Present "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" at IPC APEX EXPO

Industry News | 2021-10-31 04:57:58.0

Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.

Averatek Corporation


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