Industry News: passive component shear test (Page 8 of 22)

Nordson to Exhibit Full Range of Market Leading Test and Inspection Systems at SMT/Hybrid/Packaging 2016

Industry News | 2016-04-04 09:33:43.0

Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.

Nordson DAGE

Heraeus Electronics Develops New Production Friendly Flexible End Termination Ink

Industry News | 2023-04-03 13:41:12.0

Heraeus Electronics is pleased to announce the development of a production friendly, flexible passive component termination ink. ET2010 Flexible End Termination Ink is a first of its kind material in the market utilizing advanced polymer technology. When compared to current thermoset, epoxy-based inks in the market, Heraeus' solution offers easier shipping, storage, and handling at room temperatures.

Heraeus

Electronic Components, Parts and Their Function

Industry News | 2018-12-08 03:22:25.0

Electronic Components, Parts and Their Function

Flason Electronic Co.,limited

EP-TeQ – signs Nordic & Baltic distribution contract with Digitaltest GmbH

Industry News | 2013-05-24 18:52:24.0

EP-TeQ A/S, the Partner in consulting, sales, service and support of equipment for Electronic Production and Quality Assurance, announces that they have signed a contract with Digitaltest for sales of their hardware and software products for the Nordic and Baltic Countries.

Digitaltest Inc.

ATE Spring Pin BGA Socket for Digital Camera Processor

Industry News | 2011-01-12 15:27:11.0

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing digital camera processor - CBT-BGA-7005. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 500,000 insertions.

Ironwood Electronics

Chipset Specific, Integrated Passive Devices (IPDs) Simplify Development of Next Gen Wireless IoT Applications

Industry News | 2020-11-02 12:40:17.0

Miniaturized, front-End IPDs are specifically designed to seamlessly connect with Semtech's LoRa® SX1261, SX1262, and LLCC68 Chipsets

Johanson technology

New Vishay Dale Thin Film Wraparound Chip Resistor is released by New Yorker Electronics

Industry News | 2021-09-15 10:52:35.0

Vishay Precision Performance Resistor Series Significantly Reduces Board Space and Component Counts by Replacing Larger Resistors

New Yorker Electronics

New Vishay 30V Power Stage MOSFET Designed for Power Conversion in Computing and Telecom Applications

Industry News | 2020-12-18 11:36:37.0

New SiZF300DT 30V MOSFET Half-Bridge Power Stage with Integrated Schottky Diode Delivers 11% Higher Output Current than Other Solutions

New Yorker Electronics

Practical Components Offers Amkor TMV® PoP (Package on Package) Daisy Chain Components

Industry News | 2011-01-05 17:46:58.0

Practical Components Inc. announced the availability of daisy chain samples of Amkor Technology, Inc.’s TMV® PoP (Package on Package) solution.

Practical Components, Inc.

FINEPLACER® Micro Assembly Highlights at Productronica 2011

Industry News | 2011-08-30 20:10:58.0

At this year’s Productronica 2011, booth #A4-281, Finetech will present selected highlights from the acclaimed FINEPLACER® bonder range.

Finetech


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