Industry News | 2017-10-17 20:32:02.0
Inventec presents a new ultra low voiding formula, Ecorel Free 305-16LVD to achieve optimal voiding performance in automotive, power electronics, LED lighting and other high reliability applications, without degradation of high speed printability and chemical reliability. Solder voiding is a complex phenomenon under the combination of many interactions affecting both the reliability and quality of solder joints, in such interactions solder paste is a key contributor.
Industry News | 2017-11-24 20:19:27.0
SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 to solve HoP issues and improve ICT Testability at SMTA Exhibition: November 29, 2017 booth # 22, 9 am to 3 pm Bestronics Facility, 2243 Lundy Ave, San Jose, CA 95131
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2012-10-12 04:01:50.0
Package On Package Assembly Inspection & Quality Control Guide is the first text book covering every step in this exciting manufacturing and design lead technology and its going to be available FREE.
Industry News | 2014-05-16 14:31:53.0
While dip soldering of through-hole components has long been an easy and affordable way to automate manual soldering processes when the costs of wave soldering cannot be justified, these latest enhancements increase quality and repeatability to a degree that make Auto-Dip systems ideal for virtually any short-run, batch application.
Industry News | 2020-12-10 14:18:13.0
IP Rated Spring-Loaded DIP Pins from Adam Tech Interconnects Prevent Moisture from Entering the Pin around Barrel Seams
Industry News | 2022-06-24 10:13:15.0
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.
Industry News | 2023-05-22 18:45:34.0
SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, offering enhanced visibility and performance.
Industry News | 2012-09-20 14:20:40.0
More and more often electronics manufacturers have to deal with large, heavy or very thin boards which frequently require support pins for the placement process in order to prevent warping or vibrations. With its SIPLACE Smart Pin Support, ASM Assembly Systems provides a hardware-software combination that simplifies this previously cumbersome and complex support pin placement process for all boards.
Industry News | 2004-11-10 18:04:10.0
Frenchtown, NJ, November 2004
