Industry News | 2003-02-24 09:54:40.0
Effective March 3, Cookson Electronics Assembly Materials (Jersey City, NJ) will increase prices for its products by an average of 3 percent, the company announced today.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2020-02-20 11:16:51.0
ASYMTEK wins its 16th Service Excellence Award
Industry News | 2018-10-18 08:43:30.0
Pin-in-Paste Reflow Calculations and Special Cases
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-10-18 09:16:42.0
New Technology for Void-free Reflow Soldering
Industry News | 2009-05-07 14:57:37.0
�At the beginning of this new financial year, Henkel too has felt the effects of the persistently adverse economic climate, with our businesses turning in a very mixed set of results for the first quarter of 2009,� commented Kasper Rorsted, Chairman of the Henkel Management Board. �Our two consumer goods business sectors, Laundry & Home Care and Cosmetics/Toiletries, continued to perform very well, while the Adhesive Technologies business sector suffered from the challenges encountered in major customer industries worldwide.� Rorsted continued: �We are dissatisfied with our start to fiscal 2009. However, we are convinced that, as a result of our early introduction of countermeasures and based on our solid financial position, we will emerge from this still difficult economic environment stronger than before.�
Industry News | 2012-03-07 18:27:21.0
Kyzen announces that IPC - Association Connecting Electronics Industries® has honored Mike Bixenman, Ph.D., with the prestigious President’s Award. Dr. Bixenman was recognized for his dedicated service as the 5-31g, Cleaning and Coating Task Group chair, tremendous contributions as conference chair of past cleaning and coating conferences and speaker in numerous other IPC conferences.
Industry News | 2011-01-25 14:49:29.0
New Reflow Oven Introduced by APS Novastar - The ERO-500 Reflow Soldering System, A Five Zone, Cost-Effective Reflow Solution for Small to Medium Volume Lead-Free SMT Production and Prototyping.
