Industry News: paste transfer (Page 2 of 26)

SMTA (Surface Mount Technology Association) all day Chapter Meeting at Textron Defense Systems on Tues., June 26, 2012:

Industry News | 2012-06-18 14:49:38.0

Reliability and Failure Analysis Seminar: Lessons Learned in Manufacturing. Presented by Universal Instruments Corporation’s Advanced Process Laboratory. Hosted by Textron Defense Systems, 201 Lowell St., Wilmington, MA

Surface Mount Technology Association (SMTA)

LIVE ELECTRONICS ASSEMBLY LINE FEATURED AT ELECTRONICS MIDWEST

Industry News | 2010-09-02 16:09:40.0

Each step in the electronics assembly process will be on display and fully functioning on the show floor at Electronics Midwest, produced by IPC — Association Connecting Electronics Industries® and Canon Communications.

Association Connecting Electronics Industries (IPC)

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

Nordson Electronics Solutions introduces new Helios® system for dispensing single-component thermal interface materials

Industry News | 2022-05-05 17:28:46.0

Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste

Nordson Electronics Solutions

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

Software for non-proprietary communication and knowledge transfer on the shop floor

Industry News | 2021-04-01 08:22:32.0

A new kind of software finally puts an end to messages like "Instruction not received", "Documentation not available", or "Troubleshooting tip not received". ASM FactoryChat is the first professional messenger software for secure communication and the reliable transfer of knowledge in electronics production. ASM Factory keeps messages from employees and management, shift reports, machine documentations, work instructions, videos and more at the ready by locations, lines, machines, and software. Even messages and alarms from machines and software can be added to the shop floor communication with ASM FactoryChat and displayed in a browser. Also new is the licensing model: Customers can rent the software as needed and easily scale it up or down. And thanks to its open approach, ASM FactoryChat can be used with machines and systems from other suppliers in all areas, even outside of the SMT lines. For interested parties, ASM offers a free 60-day test license that is fully functional.

ASM Assembly Systems GmbH & Co. KG

3-D solder paste inspection with Process Uplink function: More than just defect detection

Industry News | 2012-04-06 19:44:17.0

In SMT electronic assembly production, 3-D SPI has established itself as the additional inspection gate to complement optical or X-ray inspection.

Viscom AG

Kester Launches NP560 Solder Paste

Industry News | 2018-03-12 14:11:35.0

Kester is proud to announce the launch of NP560, a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.

Kester

Indium Corporation Features New Probe-Testable Solder Paste at APEX

Industry News | 2008-02-28 15:03:16.0

Indium8.9 Pb-Free Solder Paste is an air reflow no-clean solder paste that prints perfectly every time.

Indium Corporation

Dr. Mike Bixenman to Present Understencil Video Effects Study at SMTAI

Industry News | 2014-09-22 17:20:24.0

KYZEN Corporation’s Dr. Mike Bixenman will present the technical cleaning process technologies paper titled “Understencil Video Effects to Study Solder Paste Transfer and Wiping Effects” at the upcoming SMTA International exhibition.

KYZEN Corporation


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