Industry News | 2008-03-15 15:22:12.0
OSAKA, JAPAN � March 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 249 at the upcoming APEX exhibition and conference, scheduled to take place April 1-3, 2008 in Las Vegas.
Industry News | 2023-10-31 18:58:18.0
SHENMAO America, Inc. is proud to announce that it received a 2023 Mexico Technology Award for its groundbreaking SMBF-08 Visible No-Clean BGA Flux. The award was announced at a ceremony on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo. This innovative flux has redefined surface mount technology (SMT) assembly and BGA ball mount processes, offering unparalleled visibility and performance.
Industry News | 2002-04-09 08:02:34.0
QuickStart, Was the Result of More than Two Years of Collaborative Research and Development Between Indium and Motorola
Industry News | 2012-01-22 23:52:22.0
Viscom AG sold a high-end S2088-II Desktop AOI inspection system to Mosca Elektronik und Antriebstechnik GmbH during Productronica 2011. The company recently completed the successful installation at its facility in Buchen, Germany.
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2012-10-09 16:18:14.0
The ULTIMA Series Selective Soldering and Fluxing Systems offer a new solution for soldering through-hole components and connectors to surface mount and mixed technology PCBs. Numerous engineering and design innovations have resulted in compact, bench-top systems loaded with features that deliver a level of performance that, until now, would have made selective soldering cost-prohibitive for many low- and medium-volume PCB assemblers.
Industry News | 2024-06-10 10:18:21.0
StenTech® Inc. is excited to announce its participation at the SMTA Querétaro Expo & Tech Forum on Thursday, June 6, 2024. The company's local team in Mexico will be present to discuss the advanced StenTech BluPrint™ PVD (Physical Vapor Deposited) Surface Treatment, engineered to enhance SMT processes, improve stencil performance and longevity, and streamline production.
Industry News | 2012-09-17 16:26:16.0
Nihon Superior, has announced details of its participation in the Technical Program of SMTAI 2012
Industry News | 2013-06-06 19:06:31.0
FCT Assembly today announced that it has secured an order from a fast-growing contract manufacturer (CM) in the Northwest.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
