Industry News | 2016-02-10 17:03:46.0
MET Stencil announces the launch of the NanoSlic® Gold stencil. NanoSlic® is the world's most advanced stencil coating technology for improving solder paste printing. "We are pleased to announce that we have been licensed by FCT Assembly to sell this coating to the US market.” said Fred Cox, President of MET Stencil. "Stencil users will immediately see the benefits in their print."
Industry News | 2010-09-02 11:08:19.0
The DEK team is currently preparing for the launch of its new ProActiv technology, being billed as one of the company’s most important technology breakthroughs of recent years. To support the launch, DEK will be highlighting ProActiv’s ability to revolutionize paste transfer efficiency with an exclusive webinar being held on 24th and 27th September 2010. Participants can choose from six seminar sessions being held in different languages and at different dates and times.
Industry News | 2015-10-13 19:27:42.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (
Industry News | 2014-01-30 19:41:40.0
FCT Assembly announces that Fine Line Stencil is the sole licensee of the NanoSlic® Coating Technology.
Industry News | 2010-03-04 11:12:24.0
Indium8.9HF-1 Solder Paste is a no clean Pb-free halogen-free solder paste that offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.
Industry News | 2016-05-21 07:36:35.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Industry News | 2016-07-07 14:47:47.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Industry News | 2014-01-22 11:00:42.0
FCT Assembly announces the launch of the NanoSlic® Gold stencil. NanoSlic® is the world’s most advanced stencil technology for solder paste printing.
Industry News | 2014-02-18 17:14:55.0
FCT Assembly will debut the new NanoSlic® Gold stencil in Booth #2175 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2014-09-09 21:35:30.0
FCT Assembly today announced plans to exhibit in Booth # I105 at OctoberBest 2014, scheduled to take place Wednesday, October 1, 2014 at Tektronix in Beaverton, OR.
