Industry News | 2014-07-14 06:48:21.0
unced that it will exhibit at the Ohio SMTA Expo & Forum, scheduled to take place Thursday, July 17, 2014 at the Doubletree Cleveland – Independence.
Industry News | 2016-02-11 13:36:43.0
Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.
Industry News | 2008-07-24 18:07:41.0
When DEK's revolutionary VectorGuard� stencil technology was introduced six years ago, the company pledged ongoing engineering investments to deliver foil designs to serve countless next-generation applications. Living up to this promise, DEK's latest advance, VectorGuard Platinum�, was introduced last week at Semicon West and its ingenuity earned a prized Advanced Packaging Award.
Industry News | 2015-09-01 13:01:04.0
FCT Assembly (www.fctassembly.com), well-known in the electronics assembly industry for its Fine Line Stencil and FCT Solder divisions, will highlight its broad portfolio of products at SMTA International 2015 (www.smta.org/smtai/), as well as take part in the conference program and live process demonstrations on the show floor.
Industry News | 2014-08-28 11:13:11.0
FCT Assembly today announced that Field Application Engineer Tony Lentz will present paper titled “Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design” at the upcoming SMTA International exhibition.
Industry News | 2012-07-25 10:17:38.0
AIM, will highlight its new NC259 Solder Paste
Industry News | 2014-11-04 17:42:23.0
FCT Assembly today announced that field application engineer, Tony Lentz, received high scores for his presentation during SMTAI. Lentz presented the paper titled “Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design” in Rosemont, IL last month.
Industry News | 2013-01-16 08:45:06.0
Nihon Superior Co. Ltdwill introduce a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, lead-free die attach, void minimization, environmental protection, and process yields.
Industry News | 2008-02-03 21:54:45.0
Three of Indium Corporation�s technology experts will be presenting at APEX, IPC Printed Circuits Expo March 29 -April 3, 2008: Vice President of Technology, Dr. Ning-Cheng Lee; Senior Technologist, Dr. Ronald C. Lasky, Ph.D.; and Solder Paste Product Manager, Tim Jensen.
Industry News | 2010-08-04 21:14:00.0
Indium8.9HF-1 Solder Paste is a no-clean Pb-free halogen-free solder paste that offers the best-in-class probe-testability and unprecedented stencil print transfer efficiency to work in the broadest range of processes.
