Industry News: paste transfer (Page 7 of 26)

FCT Assembly’s Tony Lentz Receives Glowing Speaker Evaluation from SMTA

Industry News | 2014-11-04 17:42:23.0

FCT Assembly today announced that field application engineer, Tony Lentz, received high scores for his presentation during SMTAI. Lentz presented the paper titled “Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design” in Rosemont, IL last month.

FCT ASSEMBLY, INC.

Nihon Superior to Exhibit Range of Innovative Products at the 2013 IPC APEX EXPO

Industry News | 2013-01-16 08:45:06.0

Nihon Superior Co. Ltdwill introduce a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, lead-free die attach, void minimization, environmental protection, and process yields.

Nihon Superior Co., Ltd.

StenTech to Showcase Advanced Nano Coating and Stencil Solutions at SMTA Chihuahua

Industry News | 2023-08-29 07:23:24.0

StenTech® Inc. is excited to announce its participation at SMTA Chihuahua, taking place on Thursday, Sept. 7, 2023 at the Sheraton Chihuahua Soberano. The company will exhibit its highly acclaimed Advanced Nano Coating and showcase its complete product line of various stencils and tooling.

Stentech

StenTech Wins 2023 GLOBAL Technology Award for Advanced Nano Coating Stencils at productronica in Munich

Industry News | 2023-11-20 14:30:54.0

StenTech® Inc. is pleased to announce that it received a 2023 GLOBAL Technology Award in the category of Stencils for its groundbreaking Advanced Nano Coating. The award ceremony took place during productronica, the world's leading trade fair for electronics development and production in Munich, Germany.

Stentech

Stencil Technology for SMT production

Industry News | 2018-10-18 08:39:14.0

Stencil Technology for SMT production

Flason Electronic Co.,limited

Indium Corporation�s Technology Experts Presenting at APEX

Industry News | 2008-02-03 21:54:45.0

Three of Indium Corporation�s technology experts will be presenting at APEX, IPC Printed Circuits Expo March 29 -April 3, 2008: Vice President of Technology, Dr. Ning-Cheng Lee; Senior Technologist, Dr. Ronald C. Lasky, Ph.D.; and Solder Paste Product Manager, Tim Jensen.

Indium Corporation

Indium Corporation Features New Halogen-Free Pb-Free Solder Paste at NEPCON Shenzhen

Industry News | 2010-08-04 21:14:00.0

Indium8.9HF-1 Solder Paste is a no-clean Pb-free halogen-free solder paste that offers the best-in-class probe-testability and unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Indium Corporation

Indium Corporation Features Void-Reducing Solder Paste Indium8.9HF at Productronica

Industry News | 2015-10-27 22:08:05.0

Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.

Indium Corporation

How the modern solder reflow oven works?

Industry News | 2018-10-18 08:36:26.0

How the modern solder reflow oven works?

Flason Electronic Co.,limited

StenTech's Greg Starrett to Present Stencil Technology & Guidelines at the SMTA Long Island Meeting

Industry News | 2023-05-15 18:03:27.0

StenTech® Inc. is pleased to announce that Greg Starrett, Director of Sales, will present at the Long Island Chapter In-Person Technical Meeting on Wednesday, May 31, 2023. The event will be held at Zebra Technologies and will cover the topic of "Fine Feature Paste Printing, Stencil Design and Solder Technology."

Stentech


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