Industry News: paste transfer (Page 8 of 26)

Indium8.9HFA Solder Paste Sees Accelerated Adoption for Miniaturized Assemblies

Industry News | 2013-11-01 13:32:41.0

Indium Corporation's Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting this remarkable new product at an accelerating pace.

Indium Corporation

FINETECH to Exhibit Direct Component Print Solution at APEX 2009

Industry News | 2009-03-10 14:58:48.0

FINETECH will showcase the Direct Component Print Module at APEX 2009 (Booth #2059), scheduled for March 31 � April 2, 2009, at the Mandalay Bay Convention Center in Las Vegas.

Finetech

Indium Corporation Expert to Present at International Conference on Soldering and Reliability

Industry News | 2014-05-06 10:43:05.0

Indium Corporation's Ed Briggs, senior technical support engineer, will present at the International Conference on Soldering and Reliability Wednesday, May 14 in Toronto, Canada.

Indium Corporation

Indium Corporation Technology Expert to Present at SMTA Space Coast and Tampa Bay Expo & Tech Forum

Industry News | 2014-11-04 16:57:54.0

Indium Corporation's Ed Briggs, senior technical support engineer, will present at the SMTA Space Coast and Tampa Bay Expo & Tech Forum on Dec. 4 in Kissimmee, Fla.

Indium Corporation

FCT Assembly’s Technical Support Expert to Present during Joint Workshop in Dallas

Industry News | 2013-05-28 14:17:55.0

FCT Assembly announces that Greg Smith, Regional Sales Manager and Technical Support, will present at a joint cleaning and reliability workshop held in cooperation with Aqueous Technologies, Kyzen and Nordson DAGE.

FCT ASSEMBLY, INC.

PRESS RELEASE: New Product Announcement

Industry News | 2017-01-24 10:55:12.0

BP 256 is YINCAE’s new ball attach adhesive product

YINCAE Advanced Materials, LLC.

AIM Solder to Exhibit NC259 Solder Paste at SMT Hybrid Packaging 2013

Industry News | 2013-03-18 17:06:13.0

AIM Solder announces that it will highlight its new NC259 Solder Paste in representative smartTec GmbH’s booth, which is located in Hall 7, Booth 219 at the upcoming SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

AIM Solder

Indium Corporation’s Low-Voiding Solder Pastes Featured at IPC APEX 2016

Industry News | 2016-03-17 14:15:35.0

Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo.

Indium Corporation

Indium Corporation's Indium8.9HF Solder Paste Series Technology Solution to Avoid the Void™

Industry News | 2016-04-06 12:15:05.0

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany.

Indium Corporation

AIM to Showcase NC259 Solder Paste at the 2013 Del Mar Show

Industry News | 2013-04-01 09:02:49.0

AIM Solder today announced that it will highlight its new NC259 Solder Paste in Booth #554-556 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA

AIM Solder


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