Industry News: paste transfer (Page 9 of 26)

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

Industry News | 2013-04-08 19:29:43.0

AIM Solder will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.

AIM Solder

Indium Corporation Features SACM™ High-Reliability Solder Paste at APEX

Industry News | 2014-03-04 12:06:53.0

Indium Corporation will feature its new technology platform using SACM™ solder paste at APEX March 25-27 in Las Vegas, Nevada.

Indium Corporation

Indium Corporation Features SACm™ High-Reliability Solder Paste at SMT Hybrid Packaging

Industry News | 2014-04-30 13:47:54.0

Indium Corporation will feature SACm™ solder paste at SMT Hybrid Packaging May 6-8 in Nuremberg, Germany.

Indium Corporation

StenTech Launches Online Order Management System for Ordering Stencils

Industry News | 2022-11-29 07:29:41.0

StenTech Inc. is pleased to offer customers the ability to easily place stencil orders online with its new Online Order Management System.

Stentech

StenTech Awarded for Advanced Nano Coating for Stencil Performance & Precision

Industry News | 2023-10-31 19:19:30.0

StenTech® Inc. today announced that it received an esteemed 2023 Mexico Technology Award in the category of Screen/Stencil Printing Consumables. The award celebrates StenTech's revolutionary Advanced Nano Coating, a groundbreaking technology that sets a new benchmark for stencil performance and precision. The award was announced at a ceremony that took place Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.

Stentech

Indium Corporation Low-Voiding Solder Paste Helps Users Avoid the Void at Productronica 2015

Industry News | 2015-11-14 15:34:42.0

Indium Corporation presented its suite of void-reducing solder pastes, including halogen-free, no-clean Indium8.9HF, at Productronica 2015, Nov. 10-13, in Munich, Germany

Indium Corporation

SHENMAO Features LED Die Bonding Solder Pastes at IPC APEX 2016

Industry News | 2016-03-10 18:40:47.0

SHENMAO proudly announces a series of Lead-free LED Die Bonding Solder Pastes made locally in the USA and with the same quality in 8 other worldwide locations for various Die Bonding processes. Powder Size is available from T3 to T8.

Shenmao Technology Inc.

Tresky presents metallic sintering for power electronics at productronica 2023

Industry News | 2023-10-30 19:21:14.0

Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.

Tresky AG

Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes

Industry News | 2014-04-30 13:42:31.0

Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

Indium Corporation

Juki to Showcase Its Latest Automated Assembly Solutions at IPC APEX EXPO

Industry News | 2011-03-10 21:20:06.0

Juki Corporation will showcase its latest assembly systems in Booth #1559 at the upcoming IPC APEX EXPO.

Juki Automation Systems


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