Industry News | 2013-05-29 16:43:31.0
FCT Assembly today announced that its representative Production Automation Corp (PAC) closed a new solder paste account for FCT in Southern California.
Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
Industry News | 2010-12-07 15:07:35.0
Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.
Industry News | 2014-03-02 18:55:28.0
PARMIannounces that it will exhibit in booth #1249 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2012-08-23 12:36:58.0
Smyczek GmbH & Co. KG, based in Verl, Germany, announces that it has optimized its SMT processes with the implementation of 3D paste inspection with Process Uplink by Viscom.
Industry News | 2008-04-07 23:18:22.0
MORRISVILLE, NC - March 31, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that its OPASS technology won a NPI Award in the Software category. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2008-04-08 22:36:16.0
MORRISVILLE, NC - April 2, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces it was named as a first finalist for its OPASS technology in the Design and Manufacturing Software category during the VISION Awards announcement ceremony that took place Wednesday, April 2, 2008 in Las Vegas during APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2008-04-08 23:53:03.0
MORRISVILLE, NC - April 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it won a 2008 SMT China Vision Award for its OPASS technology in the Software - Production category during an awards ceremony that took place April 8, 2008 at the Shanghai Everbright Convention & Exhibition International Hotel during NEPCON China/EMT China. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2018-01-24 20:47:58.0
SHENMAO America today announced plans to exhibit in Booth #2344 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company’s new PF606-P140 / PF606-P245 Lead-free Zero Halogen Solder Pastes can eliminate Head-in-pillow (HiP) defects, voids, slumping, non-wetting opens and short stencil life.
Industry News | 2015-07-20 07:36:12.0
SMTA/NPL Printing & Assembly Automatic Optical Inspection Experience is a special feature we are organising in Chicago this year and we are looking for Solder Paste Inspections SPI and Automatic Optical Inspection systems to test our specially produced boards. If you would like to show your technology contact us bobwillis@smta.org
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